An apparatus for solder joining metal tapes to form laminated metal tapes comprises an alignment box having a base and a sidewall means extending therefrom to define a tapered inner channel extending through the box. The tapered channel having an entrance end and narrowing to an exit end. At least one tapered wall extending from the base and within the inner channel to define subchannels that are spaced at the entrance end and converge into the inner channel before the exit end. The sidewall means and tapered wall extending from the base to respective wall tops, and a cover extending over the channel and subchannels is mounted on the wall tops. The base, sidewalls, inner wall, and cover being configured to form the channel and subchannels to have a first preselected distance between the base and cover that is greater than the width of the tapes. A second preselected distance between oppositely facing walls bordering the subchannels that is greater than the thickness of the tapes, and a third preselected distance between oppositely facing walls at the exit end that is greater than the thickness of the laminated tapes. A solder duct means mounted on the box for directing molten solder into the inner channel to flow from the exit end to the entrance end. The solder duct means having a slot extending therethrough and aligned with the exit end. A seal means mounted on the solder duct means adjacent the slot for minimizing solder escaping from the slot while solder coated tapes pass therefrom, and a wiper means mounted on the solder duct means and positioned from the seal means removes excess solder from tapes passing through the seal means.