摘要:
An apparatus for solder joining metal tapes to form laminated metal tapes comprises an alignment box having a base and a sidewall means extending therefrom to define a tapered inner channel extending through the box. The tapered channel having an entrance end and narrowing to an exit end. At least one tapered wall extending from the base and within the inner channel to define subchannels that are spaced at the entrance end and converge into the inner channel before the exit end. The sidewall means and tapered wall extending from the base to respective wall tops, and a cover extending over the channel and subchannels is mounted on the wall tops. The base, sidewalls, inner wall, and cover being configured to form the channel and subchannels to have a first preselected distance between the base and cover that is greater than the width of the tapes. A second preselected distance between oppositely facing walls bordering the subchannels that is greater than the thickness of the tapes, and a third preselected distance between oppositely facing walls at the exit end that is greater than the thickness of the laminated tapes. A solder duct means mounted on the box for directing molten solder into the inner channel to flow from the exit end to the entrance end. The solder duct means having a slot extending therethrough and aligned with the exit end. A seal means mounted on the solder duct means adjacent the slot for minimizing solder escaping from the slot while solder coated tapes pass therefrom, and a wiper means mounted on the solder duct means and positioned from the seal means removes excess solder from tapes passing through the seal means.
摘要:
Two Nb.sub.3 Sn superconducting tapes are overlapped by an amount equal to about two times the width of the superconducting tapes. A filler material of material substantially similar to the tapes is placed between the two tapes in the overlapped region. A NdYAG laser (4) sends a 20-40 watt beam focused by a lens that heats the tapes to create a bridge of superconductivity material formed over the region where the tapes are joined.
摘要:
Superconducting tapes having an inner laminate comprised of a parent-metal layer, a superconductive alloy layer on the parent-metal, a reactive-metal layer, and an outer laminate soldered thereon are joined in a superconducting joint by the method of this invention. The outer laminate is removed to form exposed sections, and the tapes are positioned so that the exposed sections are in contact. A melt zone within the exposed sections where the exposed sections are in contact is melted. The melt zone is at least large enough to provide sufficient parent-metal, superconductive alloy, and reactive-metal to form a melt that resolidifies as a continuous precipitate of the superconductive alloy. The melt resolidifies as a continuous precipitate of the superconductive alloy that is continuous with the superconductive alloy on the superconducting tape. Optionally, sections of the outer laminate material corresponding to the size of the exposed sections are bonded to the outermost surfaces of the joined exposed sections.
摘要:
An apparatus for filtering a molten solder bath comprises, a housing having an entrance end and an exit end enclosing a channel means extending from the entrance end to a filter means adjacent the exit end. The channel means being configured for receiving molten solder at the entrance end and directing the solder to the filter means in a turbulent flow. The filter means being configured to filter particles from the flow and direct the filtered flow to the exit end. A cooling means is positioned on the housing for cooling solder flowing through the channel means without reacting with the solder. A method for filtering a molten solder bath comprises, directing solder from the bath in a turbulent flow and cooling the flow to form a precipitate of an impurity in the molten solder. The cooled flow is filtered to remove particles and form a high-purity solder, and the high-purity solder is returned to the bath. Preferably, the molten solder is protected by an inert atmosphere that does not react with the solder.
摘要:
An apparatus for filtering a molten solder bath comprises, a housing having an entrance end and an exit end enclosing a chanel means extending from the entrance end to a filter means adjacent the exit end. The channel means being configured for receiving molten solder at the entrance end and directing the solder to the filter means in a turbulent flow. The filter means being configured to filter particles from the flow and direct the filtered flow to the exit end. A cooling means is positioned on the housing for cooling solder flowing through the channel means without reacting with the solder. A method for filtering a molten solder bath comprises, directing solder from the bath in a turbulent flow and cooling the flow to form a precipitate of an impurity in the molten solder. The cooled flow is filtered to remove particles and form a high-purity solder, and the high-purity solder is returned to the bath. Preferably, the molten solder is protected by an inert atmosphere that does not react with the solder.
摘要:
Superconducting tapes have an inner laminate comprised of a parent-metal layer selected from the group niobium, tantalum, technetium, and vanadium, a superconductive intermetallic compound layer on the parent-metal layer, and a reactive-metal layer that is capable of combining with the parent-metal and forming the superconductive intermetallic compound. A superconducting joint between contiguous tapes comprises, a continuous precipitate of the superconductive intermetallic compound fused to the tapes forming a continuous superconducting path between the tapes.
摘要:
A method for making triniobium tin foil is disclosed where the niobium-based foil with an oxide layer is passed continuously at a set speed into an enclosed chamber. The enclosed chamber has an inert atmosphere which is substantially oxygen free. Upon entering the chamber, the foil passes through a decomposition anneal furnace, a low temperature tin dip, and then a high temperature reaction anneal furnace before exiting the chamber as triniobium tin foil.
摘要:
An apparatus for solder joining metal tapes to form laminated metal tapes comprises a channel means having a base, and sidewall means extending therefrom to a cover extending over the sidewall means. The sidewall means define converging channels having an entrance end for admitting the tapes spaced apart, and an exit end where facing tape surfaces can come into contact. The sidewall means separate the base and cover by a distance selected to align the tapes in the width dimension. The cover having a first section extending from the exit end, and a second section extending from the first section to the entrance end, the second section being formed with a cavity facing the channel that permits a solder flow therethrough that minimizes accumulation of particles in the channels. A solder duct means mounted on the channel means for directing molten solder into the channels to flow from the exit end to the entrance end. The solder duct means having a slot extending therethrough and aligned with the exit end. A seal means mounted on the solder duct means adjacent the slot for minimizing solder escaping from the slot while solder coated tapes pass therefrom, and a wiper means mounted on the solder duct means and positioned from the seal means removes exess solder from tapes passing through the seal means.
摘要:
A method is described which increases the critical current of triniobium tin by bonding thermal contraction control layers to the triniobium tin superconducting articles at a process temperature to form a composite, and subsequently cooling the composite to a test temperature.
摘要:
An improved method for forming fluid inflatable metal structures is taught. The improvement concerns the patterning of the portion of the structure to be inflated. Patterning is accomplished by first applying a strippable flexible mask coating and then scoring this coating so that a patterned portion may be removed therefrom. The parent portion is the portion of the sheet article to be inflated by subsequent processing. After the patterned portion has been removed, a stop-off is applied to the exposed surface of the first sheet. After the stop-off material has been applied, the remainder of the strippable mask is removed and washed with a detergent to remove the residue from the mask. The sheet having stop-off applied in the pattern to the first sheet is then superposed over a second sheet, and heat and pressure are applied to cause diffusion bonding between the exposed surfaces of the two sheets. Following this bonding, the portion of the sheet carrying the stop-off is inflated to give the article its final configuration.