发明授权
- 专利标题： Method of making a hybrid electronic array
- 专利标题（中）： 制造混合电子阵列的方法
-
申请号： US611017申请日： 1990-11-09
-
公开(公告)号： US5125153A公开(公告)日： 1992-06-30
- 发明人: Raymond Frey , Fredy Glaus , Fredy Heusler , Jurg Steinmann
- 申请人： Raymond Frey , Fredy Glaus , Fredy Heusler , Jurg Steinmann
- 申请人地址： CHX Zurich
- 专利权人： Oerlikon-Contraves AG
- 当前专利权人： Oerlikon-Contraves AG
- 当前专利权人地址： CHX Zurich
- 优先权： CHX4068/89 19891109
- 主分类号： H05K1/18
- IPC分类号： H05K1/18 ; H01L25/04 ; H01L25/07 ; H01L25/075 ; H01L25/13 ; H01L25/18 ; H01L33/00
摘要：
A method and apparatus for producing a highly packed hybrid array. The packing density of the hybrid array is increased by providing a barrier between closely adjoining strip conductors on a substrate. The barrier reduces the occurrence of short circuits between adjacent strip conductors when an adhesive that is used to glue a chip to the substrate is pushed out from under the chip.