The present invention provides a water processing film fitted on one side of the base film with a pressure-sensitive adhesive layer and further with a release film on the surface of the pressure-sensitive adhesive layer, and coated on the back side of the base film a phosphoric surfactant wherein ionic components are not detected by ion chromatography, and can prevent failure of an integrated circuit dye static electricity generated in the handling of the wafer processing film and can also inhibit contamination and corrosion of the wafer by surfactant.