发明授权
- 专利标题： Adhesive and encapsulant material with fluxing properties
- 专利标题（中）： 具有助熔性能的粘合剂和密封材料
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申请号： US588888申请日： 1990-09-27
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公开(公告)号： US5128746A公开(公告)日： 1992-07-07
- 发明人: Robert W. Pennisi , Marc V. Papageorge
- 申请人： Robert W. Pennisi , Marc V. Papageorge
- 申请人地址： IL Schaumburg
- 专利权人： Motorola, Inc.
- 当前专利权人： Motorola, Inc.
- 当前专利权人地址： IL Schaumburg
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; B23K35/36 ; B23K35/363 ; H01L21/56 ; H05K3/30 ; H05K3/34
摘要：
An adhesive material 120 including a fluxing agent is applied to either a substrate 100 having a metallization pattern 110 or a solder bumped electrical component 130. The component 130 is positioned on the substrate 110 and the solder bump 140 is reflowed. During the reflow step, the fluxing agent promotes adhesion of the solder 140 to the substrate metallization pattern 110, and the adhesive material 120 is cured to mechanically interconnect and encapsulate the substrate 110 to the component 130.
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