Invention Grant
- Patent Title: Vacuum evaporation apparatus and method for making vacuum evaporated sheet
- Patent Title (中): 真空蒸发装置及真空蒸镀板的制造方法
-
Application No.: US618310Application Date: 1990-11-28
-
Publication No.: US5132506APublication Date: 1992-07-21
- Inventor: Hidenobu Shintaku , Isamu Inoue , Ryutarou Akutagawa , Shigeo Suzuki , Hirozo Takegawa , Kayoko Kodama
- Applicant: Hidenobu Shintaku , Isamu Inoue , Ryutarou Akutagawa , Shigeo Suzuki , Hirozo Takegawa , Kayoko Kodama
- Applicant Address: JPX Kadoma
- Assignee: Matsushita Electric Industrial Co., Ltd.
- Current Assignee: Matsushita Electric Industrial Co., Ltd.
- Current Assignee Address: JPX Kadoma
- Main IPC: C23C14/24
- IPC: C23C14/24 ; C23C14/30
Abstract:
A vacuum evaporation apparatus has a melting pot containing evaporating material therein and a movable partition. A surface of the evaporating material is separated into a supplying surface (whereinto a Cr-Co material rod of replenishing material is supplied) and an evaporating surface (whereonto an electron beam is irradiated) by the partition only during deposition of evaporating material onto a substrate. After finish of the deposition, the partition is lifted and is apart from the surface.
Public/Granted literature
- US5735642A Trench shield handling assembly Public/Granted day:1998-04-07
Information query
IPC分类: