A test arrangement for printed wiring boards or the like employs a probe to contact the various nodes on the circuit board and charge or discharge these nodes. A reference plane of electrically conductive material is closely spaced from the board under test, and a charge-transfer detection or measurement arrangement is connected to this reference plane. The circuit board is mounted on an X-Y positioning mechanism while the test is being conducted, so the probe can be selectively applied to each of the conductive nodes of the circuit board. The charging of the nodes by capacitive coupling to the reference plane is measured and correlated with the probe position to provide an indication of circuit integrity. The measurements made on the board under test are compared with a reference data file of the X-Y coordinates of the nodes to determine whether or not there are discrepancies, and if so, the locations.