A method for forming a coating film with a relief pattern, which comprises coating an undercoating material on a substrate surface to form a cured undercoating film, coating an intermediate coating material partly on the undercoating film in a desired pattern, drying it to such an extent that the amount of the solvent in the formed intermediate coating film is within a range of from 1 to 50% by weight, then overcoating a top coating material comprising, as binders, a polyester resin and an aminoplast resin cross-linking agent having a surface tension of at least 40 dyn/cm over the entire surface, followed by baking and curing to form a top coating film with the relief pattern.