发明授权
- 专利标题： Radiation-curable adhesive tape
- 专利标题（中）： 可辐射固化胶带
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申请号： US631902申请日： 1990-12-21
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公开(公告)号： US5149586A公开(公告)日： 1992-09-22
- 发明人: Shinichi Ishiwata , Michio Ueyama , Hiroyuki Nakae , Yoshiyuki Funayama , Kazushige Iwamoto , Isamu Noguchi
- 申请人： Shinichi Ishiwata , Michio Ueyama , Hiroyuki Nakae , Yoshiyuki Funayama , Kazushige Iwamoto , Isamu Noguchi
- 申请人地址： JPX Tokyo
- 专利权人： Furukawa Electric Co., Ltd.
- 当前专利权人： Furukawa Electric Co., Ltd.
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX62-168515 19870708; JPX63-76185 19880331; JPX63-76186 19880331; JPX63-78201 19880401; JPX63-78202 19880401
- 主分类号： C09J4/06
- IPC分类号： C09J4/06 ; C09J7/02
摘要：
There is a radiation-curable adhesive tape comprising a radiation-curable adhesive layer which is formed on a radiation transmitting-substrate. The radiation-curable adhesive layer is composed of an acrylic adhesive and radiation-curable compound having carbon-carbon double bonds. The radiation-curable tape can be used preferably in processing steps for the production of semiconductor wafer, ceramics and glass employing a direct picking-up system.
公开/授权文献
- US5906683A Lid assembly for semiconductor processing chamber 公开/授权日：1999-05-25
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