发明授权
- 专利标题： Cooling structure of a test head for IC tester
- 专利标题（中）： IC测试仪测试头的冷却结构
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申请号： US632335申请日： 1990-12-21
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公开(公告)号： US5153815A公开(公告)日： 1992-10-06
- 发明人: Shinya Suzuki , Seiichi Hirose
- 申请人： Shinya Suzuki , Seiichi Hirose
- 申请人地址： JPX Tokyo
- 专利权人： Ando Electric Co., Ltd.
- 当前专利权人： Ando Electric Co., Ltd.
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX1-332371 19891221
- 主分类号： G12B15/02
- IPC分类号： G12B15/02 ; G01R31/26 ; H01L21/66 ; H01L23/473 ; H05K7/20
摘要：
There is disclosed a cooling structure of a test head for IC tester capable of effectively cooling ICs mounted on printed boards. The ICs can be cooled by providing a hinge between the printed boards disposed around a pipe, retaining cooling plates having a conduit by the hinge and flowing fluid having a large specific heat such as water into the conduit.
公开/授权文献
- US5752841A IC card connector and IC card reader/writer 公开/授权日：1998-05-19
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