An integrated series capacitor includes two capacitors mounted in series in a unitary insulated package. The capacitors are formed of stacked plates separated by a dielectric material. Every other stacked plate for each capacitor terminates along an outer termination edge that is connected to a solder connection on an end of the insulated package. These stacked plates alternate with every other plate which has an inner termination edge. The inner termination edges of each capacitor are connected. The integrated series capacitor is adapted for connection to a circuit board between a chip supply voltage (Vss) and a ground connection (Vss) to provide a decoupling circuit to replace two separate series wired capacitors.