发明授权
- 专利标题： Pressure sensor with high modules support
- 专利标题（中）： 高压模块支持的压力传感器
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申请号： US677309申请日： 1991-03-29
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公开(公告)号： US5157972A公开(公告)日： 1992-10-27
- 发明人: David A. Broden , Brian J. Bischoff , Bennett L. Louwagie
- 申请人： David A. Broden , Brian J. Bischoff , Bennett L. Louwagie
- 申请人地址： MN Eden Prairie
- 专利权人： Rosemount Inc.
- 当前专利权人： Rosemount Inc.
- 当前专利权人地址： MN Eden Prairie
- 主分类号： G01L7/08
- IPC分类号： G01L7/08 ; G01L9/00 ; G01L9/12 ; G01L13/00
摘要：
A metal thin film bonds a semiconductor bonding region of a diaphragm layer to a ceramic bonding region of a high modulus support block. The arrangement isolates a pressure sensing diaphragm from undesired strain, improving sensor accuracy. A passageway through the support block couples the fluid pressure to the sensing diaphragm to deflect it. Capacitive coupling between the diaphragm and a capacitor plate on the support block sense the deflection and provide an output representative of pressure.
公开/授权文献
- US5900160A Methods of etching articles via microcontact printing 公开/授权日：1999-05-04