发明授权
- 专利标题： Semiconductor device having a particular chip pad structure
- 专利标题（中）： 具有特定芯片焊盘结构的半导体器件
-
申请号： US649712申请日： 1991-02-01
-
公开(公告)号： US5159434A公开(公告)日： 1992-10-27
- 发明人: Ryuji Kohno , Makoto Kitano , Asao Nishimura , Akihiro Yaguchi , Sueo Kawai
- 申请人： Ryuji Kohno , Makoto Kitano , Asao Nishimura , Akihiro Yaguchi , Sueo Kawai
- 申请人地址： JPX Tokyo
- 专利权人： Hitachi, Ltd.
- 当前专利权人： Hitachi, Ltd.
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX2-23457 19900201
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H01L23/495
摘要：
An encapsulated semiconductor device has a chip, a chip pad having through holes and also conducting patterns corresponding to an electrode pad of the chip, and leads. An arbitrary external terminal arrangement is obtained by combining a wire bonding operation between the conduting pattern and lead. Wire bonding is advantageously performed between the leads and electrode pads of the semiconductor chip arranged at arbitrary positions. The degree of freedom in designing areas of the chips and also a printed circuit board is improved so that a high packaging density is achieved and furthermore the printed circuit board is made compact.
公开/授权文献
- US5900221A Process of preparing a solution of cesium and rubidium salts 公开/授权日：1999-05-04
信息查询
IPC分类:
