发明授权
- 专利标题： Method and apparatus for applying solder flux
- 专利标题（中）： 施加焊剂的方法和装置
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申请号： US656385申请日： 1991-02-19
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公开(公告)号： US5164022A公开(公告)日： 1992-11-17
- 发明人: Jerrold S. Pine , Stefan Peana , Douglas W. Hendricks
- 申请人： Jerrold S. Pine , Stefan Peana , Douglas W. Hendricks
- 申请人地址： IL Schaumburg
- 专利权人： Motorola, Inc.
- 当前专利权人： Motorola, Inc.
- 当前专利权人地址： IL Schaumburg
- 主分类号： B23K3/08
- IPC分类号： B23K3/08 ; H05K3/34
摘要：
In an apparatus for depositing flux onto a solder work surface, a chamber having a plurality of openings therein is heated by means of a U-shaped current conducting heating element within which the flux chamber resides. This heating element heats the flux within the chamber until it vaporizes and is forced from the chamber through the openings onto the solder work surface.
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