发明授权
- 专利标题: Process for producing flexible printed circuit board
- 专利标题(中): 生产柔性印刷电路板的工艺
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申请号: US614483申请日: 1990-11-16
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公开(公告)号: US5167985A公开(公告)日: 1992-12-01
- 发明人: Hiroshi Ito , Hirosaku Nagano , Hiroyuki Furutani , Hitoshi Nojiri
- 申请人: Hiroshi Ito , Hirosaku Nagano , Hiroyuki Furutani , Hitoshi Nojiri
- 申请人地址: JPX Osaka
- 专利权人: Kanegafuchi Kagaku Kogyo K.K.
- 当前专利权人: Kanegafuchi Kagaku Kogyo K.K.
- 当前专利权人地址: JPX Osaka
- 优先权: JPX1-300639 19891117
- 主分类号: B32B15/088
- IPC分类号: B32B15/088 ; B05D5/12 ; C08G73/10 ; C08L79/08 ; C09D179/08 ; H05K1/03
摘要:
A process for producing a flexible printed circuit board comprising a metallic foil and a polyimide is provided, which comprises coating a metallic foil with a resin solution prepared by adding a tertiary amino compound to a solution of a polyamic acid (a polyimide precursor) represented by the following general formula (I): ##STR1## followed by the imidization thereof, the amount of said tertiary amino compound added to the solution being 10 to 50 parts by weight per 100 parts by weight of solid polyamic acid contained in said resin solution. According to the present invention, a flexible printed circuit board which is free from curling, wrinkling and warping, and which has excellent heat resistance, electrical characteristics and mechanical properties is provided with a simplified production process.
公开/授权文献
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