Invention Grant
- Patent Title: Cylindrical magnetron sputtering system
- Patent Title (中): 圆柱磁控溅射系统
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Application No.: US649311Application Date: 1991-01-30
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Publication No.: US5178743APublication Date: 1993-01-12
- Inventor: Nalin Kumar
- Applicant: Nalin Kumar
- Applicant Address: TX Austin
- Assignee: Microelectronics and Computer Technology Corporation
- Current Assignee: Microelectronics and Computer Technology Corporation
- Current Assignee Address: TX Austin
- Main IPC: C23C14/34
- IPC: C23C14/34 ; C23C14/56 ; H01J37/34 ; H01L39/24
Abstract:
A system for depositing a film on a substrate includes a sputtering system and means for causing the substrate to move through the sputtering system. Embodiments of the present invention employ a cylindrical hollow cathode magnetron sputtering system, which causes the overall film deposition system to be ideally suited for coating elongate cylindrical substrates such as wires and fibers and the like.
Public/Granted literature
- US5842056A Image magnification control device for a camera Public/Granted day:1998-11-24
Information query
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