发明授权
- 专利标题: Apparatus for manufacturing electronic parts wrapped with conductive foil
- 专利标题(中): 用于制造带导电箔的电子部件的装置
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申请号: US859584申请日: 1992-03-27
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公开(公告)号: US5187857A公开(公告)日: 1993-02-23
- 发明人: Akira Nakao , Toyofusa Endo , Takeshi Ikeda
- 申请人: Akira Nakao , Toyofusa Endo , Takeshi Ikeda
- 申请人地址: JPX Osaka JPX Tokyo
- 专利权人: Hitachi Zosen Corporation,Takeshi Ikeda
- 当前专利权人: Hitachi Zosen Corporation,Takeshi Ikeda
- 当前专利权人地址: JPX Osaka JPX Tokyo
- 优先权: JPX3-65821 19910329
- 主分类号: H01G4/40
- IPC分类号: H01G4/40 ; B31C11/00 ; H01L21/00 ; H03H3/00 ; H03H7/01
摘要:
The invention provides a novel apparatus for manufacturing electronic parts each incorporating a plurality of lead wires fully wrapped with conductive foil like noise filters for example. A turn table is intermittently shifted from the first work station to the seventh work station in the state in which an individual-unit lead-wire member is retained by a holding unit on the turn table. A predetermined lead wire is folded by respective work stations, whereas the remaining lead wires are adhered with conductive foil tapes via spot-welding process, and then these lead wires are fully wrapped with conductive foil tapes. Next, the predetermined lead wire is restored to the initial posture, and then all the lead wires are fully wrapped with insulation tapes. In this way, all the lead wires are properly processed so that they can be integrated in perfect alignment with constant pitches.
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