发明授权
- 专利标题: Naphthalene ring containing epoxy resin composition and semiconductor device encapsulated therewith
- 专利标题(中): 包含环氧树脂组合物的萘环和其中包含的半导体器件
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申请号: US645498申请日: 1991-01-24
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公开(公告)号: US5190995A公开(公告)日: 1993-03-02
- 发明人: Toshio Shiobara , Kazutoshi Tomiyoshi
- 申请人: Toshio Shiobara , Kazutoshi Tomiyoshi
- 申请人地址: JPX Tokyo
- 专利权人: Shin-Etsu Chemical Co., Ltd.
- 当前专利权人: Shin-Etsu Chemical Co., Ltd.
- 当前专利权人地址: JPX Tokyo
- 优先权: JPX2-15596 19900125
- 主分类号: C08G59/08
- IPC分类号: C08G59/08 ; C08G59/32 ; C08G59/62 ; C08L61/10 ; C08L63/04 ; H01B3/40 ; H01L23/29
摘要:
Epoxy resin compositions comprising (A) an epoxy resin of formula (1), (B) a curing agent based on a novolak type phenol resin and/or a triphenolalkane resin of formula (2), and (C) an inorganic filler are suitable for encapsulating semiconductor elements because they show good flow behavior upon casting and cure into less stressed products having improved mechanical strength, Tg, and moisture resistance. ##STR1## R.sup.1 is a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, OG is ##STR2## m is 0, 1 or 2, n is 1 or 2, and l is 0, 1, 2 or 3.