发明授权
- 专利标题: Electrical socket for leaded chip carriers
- 专利标题(中): 用于引线芯片载体的电插座
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申请号: US780666申请日: 1991-10-17
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公开(公告)号: US5192215A公开(公告)日: 1993-03-09
- 发明人: Dimitry G. Grabbe , Iosif Korsunsky , Daniel R. Ringler
- 申请人: Dimitry G. Grabbe , Iosif Korsunsky , Daniel R. Ringler
- 申请人地址: PA Harrisburg
- 专利权人: AMP Incorporated
- 当前专利权人: AMP Incorporated
- 当前专利权人地址: PA Harrisburg
- 主分类号: H01R13/193
- IPC分类号: H01R13/193 ; H05K7/10
摘要:
An electrical socket (10) for electrically connecting a leaded chip carrier (24) to a substrate is disclosed. The socket (10) includes a frame-shape base (12) with contacts (14) around the periphery of a central opening. Each contact (14) has a pair of outwardly extending, spaced apart arms (64,72) with one arm (72) having a recess (82) on an inside surface (80). The socket (10) also includes a cover (16) with locking members (18) around the periphery of a central opening. The locking members (18) include cantilever beams (90,92) which enter the space (74) between the contact arms (64,72) to press a lead (28) from the carrier (24) against one arm (64).
公开/授权文献
- US5845285A Computer system and method of data analysis 公开/授权日:1998-12-01
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