发明授权
- 专利标题： Flexible copper-applied substrates
- 专利标题（中）： 柔性铜基材
-
申请号： US787624申请日： 1991-11-04
-
公开(公告)号： US5192619A公开(公告)日： 1993-03-09
- 发明人: Shiro Konotsune , Kazutsune Kikuta , Masaya Uetsuki , Hiroaki Hase
- 申请人： Shiro Konotsune , Kazutsune Kikuta , Masaya Uetsuki , Hiroaki Hase
- 申请人地址： JPX Osaka
- 专利权人： Chisso Corporation
- 当前专利权人： Chisso Corporation
- 当前专利权人地址： JPX Osaka
- 优先权： JPX63-162982 19880630; JPX63-214185 19880829
- 主分类号： H05K1/03
- IPC分类号： H05K1/03 ; H05K3/02
摘要：
A flexible copper-applied substrate comprises a copper foil and a resin layer comprising a composite material of a polyimide and a polyimide silicone, the resin layer being directly formed on the surface of the copper foil, said substrate being producible by applying a polyamide acid composite composed of a mixed solution of a polyamide acid and a polyamide acid alkylsilane to a copper foil and heating.
公开/授权文献
信息查询
