发明授权
- 专利标题： Removal of excimer laser debris using carbon dioxide laser
- 专利标题（中）： 使用二氧化碳激光去除准分子激光碎片
-
申请号： US777057申请日： 1991-10-17
-
公开(公告)号： US5194713A公开(公告)日： 1993-03-16
- 发明人: Frank D. Egitto , Cynthia J. Moring , Daniel C. Van Hart
- 申请人： Frank D. Egitto , Cynthia J. Moring , Daniel C. Van Hart
- 申请人地址： NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： NY Armonk
- 主分类号： H01L21/48
- IPC分类号： H01L21/48 ; H05K1/03 ; H05K3/00
摘要：
Disclosed is a method of fabricating a microelectronic circuit package. The circuit package has a reinforced fluorocarbon polymer dielectric. According to the disclosed process, vias or through holes are formed in the composite by a process that leaves debris. The debris in the formed vias or through holes is reflowed in order to smooth the via and through hole walls for subsequent plating.
公开/授权文献
信息查询
IPC分类:
