公开(公告)号：US5194713A

公开(公告)日：1993-03-16

申请号：US777057

申请日：1991-10-17

申请人： Frank D. Egitto ,  Cynthia J. Moring ,  Daniel C. Van Hart

发明人： Frank D. Egitto ,  Cynthia J. Moring ,  Daniel C. Van Hart

IPC分类号： H01L21/48 ,  H05K1/03 ,  H05K3/00

CPC分类号： H05K3/0032 ,  H01L21/486 ,  H05K3/0055 ,  H05K1/0366 ,  H05K2201/015 ,  H05K2203/107 ,  H05K2203/108 ,  H05K3/0035 ,  H05K3/0047 ,  H05K3/005

摘要： Disclosed is a method of fabricating a microelectronic circuit package. The circuit package has a reinforced fluorocarbon polymer dielectric. According to the disclosed process, vias or through holes are formed in the composite by a process that leaves debris. The debris in the formed vias or through holes is reflowed in order to smooth the via and through hole walls for subsequent plating.

摘要翻译： 公开了一种制造微电子电路封装的方法。 电路封装具有增强的氟碳聚合物电介质。 根据所公开的方法，通过留下碎片的方法在复合材料中形成通孔或通孔。 形成的通孔或通孔中的碎屑被回流以便平滑通孔和通孔壁用于随后的电镀。