发明授权
- 专利标题： Ceramic base power package
- 专利标题（中）： 陶瓷基座电源封装
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申请号： US701492申请日： 1991-05-16
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公开(公告)号： US5198885A公开(公告)日： 1993-03-30
- 发明人: Shawki S. Ibrahim
- 申请人： Shawki S. Ibrahim
- 申请人地址： IN Elkhart
- 专利权人： CTS Corporation
- 当前专利权人： CTS Corporation
- 当前专利权人地址： IN Elkhart
- 主分类号： H01L21/58
- IPC分类号： H01L21/58 ; H01L23/04 ; H01L23/057
摘要：
A high power, hermetic, low cost, high reliability package for electrical devices is described. The package includes in the preferred embodiment an aluminum nitride substrate, copper thick film ink screen printed and fired upon the substrate, a Kovar ring brazed to the copper thick film ink, a thermally dissipating device mounted, the device bonded to electrical feed-throughs that pass through the Kovar ring, and a cover bonded to said Kovar ring to form an additional part of the hermetic seal.
公开/授权文献
- US5841214A Identification mark operating with acoustic surface waves 公开/授权日：1998-11-24