Invention Grant
- Patent Title: Controlled electroless plating
- Patent Title (中): 控制电镀
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Application No.: US719979Application Date: 1991-06-24
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Publication No.: US5203911APublication Date: 1993-04-20
- Inventor: Prasit Sricharoenchaikit , Gary S. Calabrese , Michael Gulla
- Applicant: Prasit Sricharoenchaikit , Gary S. Calabrese , Michael Gulla
- Applicant Address: MA Newton
- Assignee: Shipley Company Inc.
- Current Assignee: Shipley Company Inc.
- Current Assignee Address: MA Newton
- Main IPC: C23C18/20
- IPC: C23C18/20 ; C23C18/31 ; C23C18/34 ; C23C18/52 ; H05K3/18
Abstract:
A composition for electrolessly depositing thin metal coatings in selective patterns of fine dimension. The electroless plating solutions of the invention are characterized by a low metal content and preferably, freedom from alkali or alkaline earth metal ions.
Public/Granted literature
- US5861975A Wavelength stability circuit Public/Granted day:1999-01-19
Information query
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