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公开(公告)号：US5203911A
公开(公告)日：1993-04-20
申请号：US719979
申请日：1991-06-24
CPC分类号： C23C18/52
摘要： A composition for electrolessly depositing thin metal coatings in selective patterns of fine dimension. The electroless plating solutions of the invention are characterized by a low metal content and preferably, freedom from alkali or alkaline earth metal ions.
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公开(公告)号：US5213917A
公开(公告)日：1993-05-25
申请号：US648890
申请日：1991-01-31
摘要： This invention describes methods for altering a substrate in a fine line image pattern using a microlithographic process including formation of a metal mask over a photoresist coating to protect the photoresist coating during dry development of the same. The invention also describes a method for formation of the metal mask. Briefly stated, the process of the invention comprises the steps of coating a substrate with a photoresist coating, exposing the photoresist coating so formed to a desired pattern of actinic radiation, catalyzing the entire surface of the photoresist coating with an electroless plating catalyst, developing the photoresist layer to a depth at least sufficient to remove the undesired catalyst layer in an image pattern, forming a metal pattern on the desired (remaining) catalyst layer and dry developing the remaining photoresist coating unprotected by the metal mask.
摘要翻译： 本发明描述了使用包括在光致抗蚀剂涂层上形成金属掩模的微光刻工艺来改变细线图像图案中的衬底的方法，以在其干燥显影期间保护光致抗蚀剂涂层。 本发明还描述了形成金属掩模的方法。 简要说明，本发明的方法包括以下步骤：用光致抗蚀剂涂层涂覆基材，将所形成的光致抗蚀剂涂层暴露于期望的光化辐射图形，用化学镀催化剂催化光刻胶涂层的整个表面， 光致抗蚀剂层至少足以去除图案图案中的不需要的催化剂层的深度，在期望的（剩余的）催化剂层上形成金属图案，并干燥显影未被金属掩模保护的剩余的光致抗蚀剂涂层。
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公开(公告)号：US5053318A
公开(公告)日：1991-10-01
申请号：US353770
申请日：1989-05-18
IPC分类号： G03F1/08 , C23C18/20 , C23C18/30 , C23F1/00 , C23F4/00 , G03F7/26 , G03F7/40 , H01L21/027 , H05K3/18
摘要： This invention describes methods for altering a substrate in a fine line image pattern using a microlithographic process including formation of a metal mask over a photoresist coating to protect the photoresist coating during dry development of the same. The invention also describes a method for formation of the metal mask. Briefly stated, the process of the invention comprises the steps of coating a substrate with a photoresist coating, exposing the photoresist coating so formed to a desired pattern of actinic radiation, catalyzing the entire surface of the photoresist coating with an electroless plating catalyst, developing the photoresist layer to a depth at least sufficient to remove the undesired catalyst layer in an image pattern, forming a metal pattern on the desired (remaining) catalyst layer and dry developing the remaining photoresist coating unprotected by the metal mask.
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公开(公告)号：US5213841A
公开(公告)日：1993-05-25
申请号：US523713
申请日：1990-05-15
CPC分类号： C23C18/28
摘要： A process for metal plating characterized by use of an accelerator solution of a metal reducible by stannous tin between a step of catalysis and metal deposition.
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公开(公告)号：US5158860A
公开(公告)日：1992-10-27
申请号：US607711
申请日：1990-11-01
CPC分类号： G03F7/2022 , C23C18/1608 , C23C18/1612 , C23C18/204 , C23C18/285 , C23C18/30 , C23C18/32 , C23C18/38 , H05K3/184 , H05K2203/0505 , H05K2203/0706 , H05K2203/1415
摘要： A process for selective metallization comprising the steps of providing a substrate coated with a photoresist, imaging the photoresist coating by exposure to pattern radiation and development, flood exposing the photoresist coating to activating radiation, depositing an electroless plating catalyst over the entire imaged photoresist coating and bared underlying substrate, removing the top surface of the flood exposed, catalyzed photoresist coating by development whereby plating catalyst remains in a desired selective pattern and depositing metal over the catalyzed surface to form a metal deposit in a selective pattern such as in a circuit pattern. The process is suitable for the manufacture of diverse articles including printed circuit boards.
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公开(公告)号：US20080116077A1
公开(公告)日：2008-05-22
申请号：US11602736
申请日：2006-11-21
CPC分类号： C25D21/10 , C25D3/60 , C25D17/10 , H01L24/11 , H01L2224/05001 , H01L2224/05023 , H01L2224/05147 , H01L2224/05166 , H01L2224/05184 , H01L2224/05568 , H01L2224/05655 , H01L2224/13099 , H01L2224/16 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01055 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10336 , H01L2924/14 , H05K3/3473 , H01L2924/00014
摘要： The present invention relates to a system single-metal plating, a system for binary-metal plating, and a system for solder-bump plating. The solder-bump plating system comprises a single-metal plating system for plating a preconditioned substrate to form a single-metal plated substrate; and a binary-metal plating system for plating the single-metal plated substrate. In a preferred implementation, the solder-bump plating system of the present invention is configured to single-metal plate a preconditioned substrate using a first plating solution to provide a single-plated substrate; to single-metal plate the single-plated substrate using a second plating solution to provide a double-plated substrate; and to binary-metal plate the double-plated substrate using a third plating solution to provide a solder-bump plated substrate. A novel apparatus for use in plating a substrate comprises an electrically conductive holder comprising a handle portion having at least one electrical contact and a holder portion having at least one flexible electrical contact.
摘要翻译： 本发明涉及一种单金属电镀系统，一种二元金属电镀系统和一种用于焊料凸块电镀的系统。 焊料凸块电镀系统包括用于电镀预处理衬底以形成单金属镀覆衬底的单金属电镀系统; 以及用于电镀单金属电镀基板的二元金属电镀系统。 在优选的实施方式中，本发明的焊料凸块电镀系统使用第一电镀液将单金属板配置为预处理基板，以提供单电镀基板; 使用第二电镀液将单电镀基板单金属板，以提供双电镀基板; 并且使用第三电镀液对双金属基板进行二元金属镀，以提供焊料凸块镀覆的基板。 用于电镀衬底的新型设备包括导电保持器，其包括具有至少一个电触头的手柄部分和具有至少一个柔性电触头的保持器部分。
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