发明授权
- 专利标题： Bonding apparatus
- 专利标题（中）： 接合装置
-
申请号： US885186申请日： 1992-05-19
-
公开(公告)号： US5205460A公开(公告)日： 1993-04-27
- 发明人: Koji Sato , Akio Bando
- 申请人： Koji Sato , Akio Bando
- 申请人地址： JPX Tokyo
- 专利权人： Kabushiki Kaisha Shinkawa
- 当前专利权人： Kabushiki Kaisha Shinkawa
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX3-143927 19910520
- 主分类号： H01L21/603
- IPC分类号： H01L21/603 ; B23K20/26 ; H01L21/00 ; H01L21/60
摘要：
A bonding apparatus for semiconductor devices, etc., including a bonding stage which places chips, etc. thereon, a bonding tool which press-bonds leads to the chips, etc., and a wire brush which is next to the bonding stage so as to clean the bonding tool. The wire brush is attached to the upper surface of a brush-rotating plate which is rotatable about its axis, and the brush-rotating plate is rotary-driven by a motor. A complete cleaning of all the side surfaces as well as the undersurface of the bonding tool is accomplished by bringing the bonding tool into contact with portions of the wire brush which are off the center of the rotating wire brush.
公开/授权文献
- USD327519S Golf ball 公开/授权日：1992-06-30
信息查询
IPC分类:
