发明授权
- 专利标题： Multilayer wiring substrate and production thereof
- 专利标题（中）： 多层布线基板及其制造
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申请号： US674605申请日： 1991-03-25
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公开(公告)号： US5208656A公开(公告)日： 1993-05-04
- 发明人: Haruhiko Matsuyama , Mitsuo Yoshimoto , Jun Tanaka , Fusaji Shoji , Hitoshi Yokono , Takashi Inoue , Tetsuya Yamazaki , Minoru Tanaka , Hidetaka Shigi
- 申请人： Haruhiko Matsuyama , Mitsuo Yoshimoto , Jun Tanaka , Fusaji Shoji , Hitoshi Yokono , Takashi Inoue , Tetsuya Yamazaki , Minoru Tanaka , Hidetaka Shigi
- 申请人地址： JPX Tokyo
- 专利权人： Hitachi, Ltd.
- 当前专利权人： Hitachi, Ltd.
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX2-73491 19900326
- 主分类号： H05K3/46
- IPC分类号： H05K3/46 ; H01L21/60 ; H01L23/498
摘要：
A multilayer wiring substrate having high reliability can be produced in good productivity by subjecting metal wiring layers to stabilization treatment on the surface with a metal such as Cr, Mo or the like or an aqueous solution of water glass so as to prevent generation of hillocks or whiskers and to improve chemical resistance.
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