公开(公告)号：US5208656A

公开(公告)日：1993-05-04

申请号：US674605

申请日：1991-03-25

申请人： Haruhiko Matsuyama ,  Mitsuo Yoshimoto ,  Jun Tanaka ,  Fusaji Shoji ,  Hitoshi Yokono ,  Takashi Inoue ,  Tetsuya Yamazaki ,  Minoru Tanaka ,  Hidetaka Shigi

发明人： Haruhiko Matsuyama ,  Mitsuo Yoshimoto ,  Jun Tanaka ,  Fusaji Shoji ,  Hitoshi Yokono ,  Takashi Inoue ,  Tetsuya Yamazaki ,  Minoru Tanaka ,  Hidetaka Shigi

IPC分类号： H05K3/46 ,  H01L21/60 ,  H01L23/498

CPC分类号： H01L23/49827 ,  H01L23/49822 ,  H01L2924/0002 ,  H01L2924/09701

摘要： A multilayer wiring substrate having high reliability can be produced in good productivity by subjecting metal wiring layers to stabilization treatment on the surface with a metal such as Cr, Mo or the like or an aqueous solution of water glass so as to prevent generation of hillocks or whiskers and to improve chemical resistance.

摘要翻译： 通过使金属布线层通过金属如Cr，Mo等在表面上进行稳定化处理或水玻璃水溶液，可以以良好的生产率制造具有高可靠性的多层布线基板，以防止产生小丘或 晶须并改善耐化学性。

公开(公告)号：US5753372A

公开(公告)日：1998-05-19

申请号：US500157

申请日：1995-07-10

申请人： Hideo Sotokawa ,  Miharu Otani ,  Fumio Kataoka ,  Fusaji Shoji ,  Haruhiko Matsuyama ,  Eiji Matsuzaki ,  Shogi Ikeda ,  Hidetaka Shigi ,  Tetsuya Yamazaki ,  Naoki Matsushima ,  Shirou Akamatsu

发明人： Hideo Sotokawa ,  Miharu Otani ,  Fumio Kataoka ,  Fusaji Shoji ,  Haruhiko Matsuyama ,  Eiji Matsuzaki ,  Shogi Ikeda ,  Hidetaka Shigi ,  Tetsuya Yamazaki ,  Naoki Matsushima ,  Shirou Akamatsu

IPC分类号： H01L21/312 ,  H01L21/3205 ,  H01L21/768 ,  H01L23/532 ,  H05K1/00 ,  H05K1/03 ,  H05K3/46 ,  B32B9/04

CPC分类号： H01L21/76801 ,  H01L21/312 ,  H01L21/32056 ,  H01L21/76838 ,  H01L23/5329 ,  H01L2924/0002 ,  H05K1/0346 ,  H05K3/4647 ,  H05K3/4676 ,  Y10T428/24802 ,  Y10T428/31504 ,  Y10T428/31678 ,  Y10T428/31721

摘要： The present invention provides the wiring structure having a wiring layer and insulation layer and the method of manufacturing the same, wherein at least a part of the wiring of said wiring layer comprises copper, and said insulation layer comprises the polyimide obtained by heating the polyimide precursor composition containing the polyimide precursor having the repeating unit which can be represented by the following general formula (Chemical formula 15). ##STR1## (In this formula, R.sup.1 is at least one type of quadrivalent organic group selected from among the Chemical formulae 16, while R.sup.2 is a bivalent organic group containing aromatic ring).

摘要翻译： 本发明提供具有布线层和绝缘层的布线结构及其制造方法，其中所述布线层的布线的至少一部分包括铜，并且所述绝缘层包括通过加热聚酰亚胺前体获得的聚酰亚胺 含有具有可以由以下通式表示的重复单元的聚酰亚胺前体的组合物（化学式15）。 （化学式15）（化学式16） 选自化学式16中的四价有机基团的类型，而R2是含有芳香环的二价有机基团）。

公开(公告)号：US5388328A

公开(公告)日：1995-02-14

申请号：US187546

申请日：1994-01-28

申请人： Hitoshi Yokono ,  Hideo Arima ,  Takashi Inoue ,  Naoya Kitamura ,  Haruhiko Matsuyama ,  Hitoshi Oka ,  Fumio Kataoka ,  Fusaji Shoji ,  Hideyasu Murooka ,  Masayuki Kyooi

发明人： Hitoshi Yokono ,  Hideo Arima ,  Takashi Inoue ,  Naoya Kitamura ,  Haruhiko Matsuyama ,  Hitoshi Oka ,  Fumio Kataoka ,  Fusaji Shoji ,  Hideyasu Murooka ,  Masayuki Kyooi

IPC分类号： H01L21/48 ,  H01L27/01 ,  H05K3/10 ,  H05K3/24 ,  H05K3/46

CPC分类号： H01L21/4857 ,  H05K3/4647 ,  H01L2224/1147 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/3025 ,  H05K2203/0733 ,  H05K2203/0769 ,  H05K3/108 ,  H05K3/243 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49165

摘要： A process for the fabrication of an interconnected multilayer board involves the steps of forming a metallic under-conductive layer on a base substrate, forming a windowed resist layer on the metallic under-conductive layer, filling windows of the resist layer with a conductor by plating thereby forming a conductor layer, forming another windowed resist layer on the conductor layer and filling windows of this resist layer with a conductor by plating, thereby forming a via-hole layer and to provide a two-level structure of the conductor layer and the via-hole layer. Thereafter, the resist layers and portions of the metallic under-conductor layer other than those in contact with a lower face of the conductor constituting the conductor layer are dissolved to form a two-level skeleton structure of conductor lines and spaces within the skeleton structure are filled with a varnish in a solventless form and the varnish is cured.

摘要翻译： 制造相互连接的多层板的方法包括以下步骤：在基底基板上形成金属导电层，在金属下导电层上形成窗口化抗蚀剂层，用导体用电镀填充抗蚀剂层的窗口 从而形成导体层，在导体层上形成另一个窗口化的抗蚀剂层，并通过电镀用导体填充该抗蚀剂层的窗口，从而形成通孔层，并提供导体层和通孔的两层结构 井层。 此后，除了与形成导体层的导体的下表面接触的金属下导体层的抗蚀剂层和部分被溶解以形成骨架结构内的导体线和空间的两级骨架结构 填充无溶剂形式的清漆，并且清漆被固化。

公开(公告)号：US5300735A

公开(公告)日：1994-04-05

申请号：US37543

申请日：1993-03-22

申请人： Hitoshi Yokono ,  Hideo Arima ,  Takashi Inoue ,  Naoya Kitamura ,  Haruhiko Matsuyama ,  Hitoshi Oka ,  Fumio Kataoka ,  Fusaji Shoji ,  Hideyasu Murooka ,  Masayuki Kyooi

发明人： Hitoshi Yokono ,  Hideo Arima ,  Takashi Inoue ,  Naoya Kitamura ,  Haruhiko Matsuyama ,  Hitoshi Oka ,  Fumio Kataoka ,  Fusaji Shoji ,  Hideyasu Murooka ,  Masayuki Kyooi

IPC分类号： H01L21/48 ,  H01L27/01 ,  H05K3/10 ,  H05K3/24 ,  H05K3/46 ,  H05K1/00

CPC分类号： H01L21/4857 ,  H05K3/4647 ,  H01L2224/1147 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/3025 ,  H05K2203/0733 ,  H05K2203/0769 ,  H05K3/108 ,  H05K3/243 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49165

摘要： Described herein are interconnected mutilayer boards and their fabrication processes. Multilayer conductor lines of a skeleton structure are formed by conducting multilayer metallization while including all resist layers and metallic under-conductive layers and then removing the resist layers and metallic under-conductive layers at once. Spaces between the multilayer conductor lines of the skeleton structure are then filled with a solventless varnish so that insulating layers are formed. Modules making use of such interconnected multilayer boards and computers having such modules are also described.

摘要翻译： 这里描述了互连的多层板及其制造工艺。 骨架结构的多层导体线通过导电多层金属化而形成，同时包括所有的抗蚀剂层和金属的低导电层，然后立即去除抗蚀剂层和金属的不良导电层。 然后用无溶剂清漆填充骨架结构的多层导体线之间的空隙，从而形成绝缘层。 还描述了使用这种互连的多层板的模块和具有这种模块的计算机。

公开(公告)号：US5958600A

公开(公告)日：1999-09-28

申请号：US981835

申请日：1998-01-09

申请人： Hideo Sotokawa ,  Akira Yabushita ,  Takashi Inoue ,  Hidetaka Shigi ,  Mamoru Ogihara ,  Haruhiko Matsuyama ,  Minoru Tanaka ,  Yasunori Narizuka

发明人： Hideo Sotokawa ,  Akira Yabushita ,  Takashi Inoue ,  Hidetaka Shigi ,  Mamoru Ogihara ,  Haruhiko Matsuyama ,  Minoru Tanaka ,  Yasunori Narizuka

IPC分类号： H01L23/498 ,  H01L23/538 ,  B32B15/08 ,  G03C3/00 ,  H05K1/09

CPC分类号： H01L23/5384 ,  H01L23/49866 ,  H01L23/49894 ,  H01L23/5385 ,  H01L2224/16225 ,  H01L2924/09701 ,  H01L2924/15312 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/31681 ,  Y10T428/31721

摘要： Disclosed are a highly reliable circuit board and a method of stably manufacturing the circuit board, wherein an insulator made from a specific organic insulating material is provided under a highly stressed conductor for preventing occurrence of cracks in the insulator. In addition, a method of correcting a wiring of a ceramic board is additionally adopted. The circuit board includes a thick film wiring board 1 having a first conductor pattern 2 and a thin film layer laminated on the first conductor pattern 2. The thin film layer includes a first insulator 5 on the first conductor pattern 2; a second insulator 10 on the first insulator 5; a second conductor pattern 8 formed on the first insulator 5 in such a manner as to partially pass through the first insulator 5 and to be electrically connected to the first conductor pattern 2; a wiring pattern 9 for circuit correction formed on the first insulator 5; and a third conductor pattern 11 passing through the first insulator 5 and the second insulator 10 and electrically connected to the second conductor pattern 8.

摘要翻译： PCT No.PCT / JP96 / 01909 Sec。 371日期1998年1月9日 102（e）1998年1月9日PCT PCT 1996年7月10日PCT公布。 出版物WO97 / 03542 日期1997年1月30日公开是一种高度可靠的电路板和稳定制造电路板的方法，其中由特定有机绝缘材料制成的绝缘体设置在高应力导体下面，以防止在绝缘体中发生裂纹。 此外，另外采用校正陶瓷板的布线的方法。 电路板包括具有层叠在第一导体图案2上的第一导体图案2和薄膜层的厚膜布线板1.薄膜层包括在第一导体图案2上的第一绝缘体5; 第一绝缘体5上的第二绝缘体10; 形成在第一绝缘体5上的部分地通过第一绝缘体5并与第一导体图案2电连接的第二导体图案8; 在第一绝缘体5上形成用于电路校正的布线图案9; 以及穿过第一绝缘体5和第二绝缘体10并电连接到第二导体图案8的第三导体图案11。

公开(公告)号：US5868949A

公开(公告)日：1999-02-09

申请号：US557320

申请日：1995-11-14

申请人： Hideo Sotokawa ,  Masashi Nishiki ,  Eiji Matsuzaki ,  Hidetaka Shigi ,  Toshio Terouchi ,  Mamoru Ogihara ,  Haruhiko Matsuyama ,  Minoru Tanaka

发明人： Hideo Sotokawa ,  Masashi Nishiki ,  Eiji Matsuzaki ,  Hidetaka Shigi ,  Toshio Terouchi ,  Mamoru Ogihara ,  Haruhiko Matsuyama ,  Minoru Tanaka

IPC分类号： C08G73/10 ,  H01L23/498 ,  H05K1/03 ,  H05K1/11 ,  H05K3/46 ,  B44C1/22

CPC分类号： H05K1/112 ,  H01L23/49894 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K2201/0154 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/096 ,  H05K2201/10674 ,  H05K3/4605 ,  Y10T428/24917

摘要： A metalization structure having a first conductor layer on the surface of an underlying layer and, further, a second conductor layer connected conductively with the first conductor layer in which a polyimide insulative film of low thermal expansion coefficient is present between at least an end of a pattern of the second conductor layer and the first conductor layer, for stably obtaining a metalization structure of high reliability and free from the worry of peeling of the conductor portion from a substrate or occurrence of cracking to the underlying layer.

摘要翻译： 一种金属化结构，其具有在下层的表面上的第一导体层，并且还具有与第一导体层导电连接的第二导体层，其中热膨胀系数低的聚酰亚胺绝缘膜存在于第一导体层的至少一端 第二导体层和第一导体层的图案，用于稳定地获得高可靠性的金属化结构，并且不会导致导体部分从基板剥离或者发生开裂到下层。

公开(公告)号：US6124553A

公开(公告)日：2000-09-26

申请号：US262270

申请日：1994-06-20

申请人： Yasunori Narizuka ,  Naoki Matsushima ,  Hidetaka Shigi ,  Haruhiko Matsuyama

发明人： Yasunori Narizuka ,  Naoki Matsushima ,  Hidetaka Shigi ,  Haruhiko Matsuyama

IPC分类号： H05K3/46 ,  H01L23/02 ,  H01L23/12 ,  H01L23/498 ,  H05K1/16

CPC分类号： H01L23/49838 ,  H01L23/49822 ,  H01L23/49833 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/16152 ,  H01L2924/3025

摘要： A multilayer wiring system for preventing the generation of fixing failure due to an organic residue, eliminating an increase in the number of processes and reducing an area necessary for bonding of the cap and its fabrication method. The multilayer wiring board includes at least one wiring layer made of a conductor, at least one insulating layer made of an organic matter and a board. The wiring layer and the insulating layer are alternately laminated on the board and a cap is provided for covering the insulating layer and the wiring layer. The wiring layer has a wiring pattern for forming a wiring and a frame pattern for surrounding the wiring pattern. This frame pattern includes vent holes. The insulating layer has a shield structure made of an inorganic matter around the outer peripheral portion thereof and/or in the interior thereof. The shield structure is formed of the frame patterns continuously connected to each other and the cap is joined to an uppermost layer of the shield structure.

摘要翻译： 一种用于防止由于有机残渣产生固定故障的多层布线系统，消除了工艺数量的增加并减少了盖子接合所需的面积及其制造方法。 多层布线基板包括至少一层由导体制成的布线层，至少一层由有机物制成的绝缘层和基板。 布线层和绝缘层交替地层叠在基板上，并且设置盖以覆盖绝缘层和布线层。 布线层具有用于形成布线的布线图形和用于围绕布线图案的框图案。 该框架图案包括通气孔。 绝缘层具有由外周部分和/或其内部的无机物构成的屏蔽结构。 屏蔽结构由彼此连续连接的框架图案形成，并且盖与屏蔽结构的最上层接合。

公开(公告)号：US5851681A

公开(公告)日：1998-12-22

申请号：US212766

申请日：1994-03-15

申请人： Haruhiko Matsuyama ,  Eiji Matsuzaki ,  Shozi Ikeda ,  Fumio Kataoka ,  Fusaji Shoji

发明人： Haruhiko Matsuyama ,  Eiji Matsuzaki ,  Shozi Ikeda ,  Fumio Kataoka ,  Fusaji Shoji

IPC分类号： C08G73/10 ,  G11B5/17 ,  G11B5/31 ,  H01L23/498 ,  H05K1/00 ,  G11B5/40 ,  C08G69/26

CPC分类号： H01L23/49894 ,  C08G73/10 ,  G11B5/313 ,  H05K3/4676 ,  G11B5/17 ,  G11B5/3109 ,  H01L2924/0002 ,  H05K2201/0154 ,  Y10T428/1193 ,  Y10T428/24917 ,  Y10T428/31681 ,  Y10T428/31721

摘要： This invention relates to a wiring structure having metal wiring layers and polyimide layers. An object of this invention is to overcome problems caused by oxidation of a metal surface, such as an increase in the resistance of wiring and a reduction in insulation, by preventing a reaction between a metal of the wiring layers, such as copper, and carboxyl groups of polyamic acid which make up the polyimide layers. In the wiring structure according to the present invention, the polyimide layers have been formed by heating and curing a resin composition which comprises a polyimide precursor, an amine compound and an organic solvent.

摘要翻译： 本发明涉及具有金属布线层和聚酰亚胺层的布线结构。 本发明的目的是通过防止诸如铜的布线层的金属和羧基之间的反应来克服金属表面的氧化引起的问题，例如布线电阻的增加和绝缘的减少 组成聚酰亚胺层的聚酰胺酸组。 在根据本发明的布线结构中，通过加热和固化包含聚酰亚胺前体，胺化合物和有机溶剂的树脂组合物，形成聚酰亚胺层。

公开(公告)号：US5280102A

公开(公告)日：1994-01-18

申请号：US500503

申请日：1990-03-28

申请人： Haruhiko Matsuyama ,  Fusaji Shoji ,  Atsushi Honda ,  Teruki Aizawa

发明人： Haruhiko Matsuyama ,  Fusaji Shoji ,  Atsushi Honda ,  Teruki Aizawa

IPC分类号： C09J179/08 ,  H01B3/30 ,  C08G73/10 ,  C08G8/02 ,  C08G69/26

CPC分类号： H01B3/306 ,  C09J179/08 ,  Y10T428/31721

摘要： Heat-resistant bonding materials are composed of a polyimide precursor end-capped at molecule ends thereof and/or an imide compound formed from the polyimide precursor. They may also contain fine particles of at least one material selected from metals, metal oxides, metal carbides and metal nitrides.

摘要翻译： 耐热接合材料由在其分子末端封端的聚酰亚胺前体和/或由聚酰亚胺前体形成的酰亚胺化合物组成。 它们还可以含有选自金属，金属氧化物，金属碳化物和金属氮化物中的至少一种材料的细颗粒。

公开(公告)号：US4824731A

公开(公告)日：1989-04-25

申请号：US149560

申请日：1988-01-28

申请人： Haruhiko Matsuyama ,  Fusaji Shoji ,  Shunichiro Kuwatsuka ,  Kenji Sugimoto

发明人： Haruhiko Matsuyama ,  Fusaji Shoji ,  Shunichiro Kuwatsuka ,  Kenji Sugimoto

IPC分类号： C08G73/10 ,  G11B5/31 ,  H01B3/30 ,  G11B5/40

CPC分类号： C08G73/1042 ,  C08G73/1007 ,  G11B5/3163 ,  H01B3/306 ,  Y10S428/90 ,  Y10T428/1193 ,  Y10T428/31721

摘要： A thin film magnetic head of which the insulation layer is made of a polyimide resin obtained by heat-curing a polyimide precursor represented by the following general formula (I) or (II) or a mixture thereof not only has excellent characteristics with respect to the insulation layer, i.e. satisfactory flatness, high glass transition temperature and excellent adhesiveness but also is free from film defects, i.e., exhibits high reliability: ##STR1## wherein R is, e.g., ##STR2## Ar.sup.1 is, e.g., ##STR3## Ar.sup.2 is, e.g. ##STR4## n is an integer of 1 to 100, and m is an integer of 10 to 500.

摘要翻译： 一种薄膜磁头，其绝缘层由通过热固化由以下通式（I）或（II）表示的聚酰亚胺前体或其混合物获得的聚酰亚胺树脂制成，不仅具有优异的相对于 绝缘层，即令人满意的平坦度，高玻璃化转变温度和优异的粘合性，但也没有膜缺陷，即表现出高可靠性：其中R是例如< 图像> Ar1是，例如， Ar2是例如 n为1〜100的整数，m为10〜500的整数。