发明授权
US5212576A Insulating material with coefficient linear expansion matching that of
one substrate over connection between two conductive patterns
失效
绝缘材料与两个导电图案之间的连接之间的一个基板的系数线性扩展匹配
- 专利标题： Insulating material with coefficient linear expansion matching that of one substrate over connection between two conductive patterns
- 专利标题（中）： 绝缘材料与两个导电图案之间的连接之间的一个基板的系数线性扩展匹配
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申请号： US808226申请日： 1991-12-16
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公开(公告)号： US5212576A公开(公告)日： 1993-05-18
- 发明人: Kazuo Yoshioka
- 申请人： Kazuo Yoshioka
- 申请人地址： JPX Tokyo
- 专利权人： Mitsubishi Denki Kabushiki Kaisha
- 当前专利权人： Mitsubishi Denki Kabushiki Kaisha
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX2-411296 19901218
- 主分类号： G02F1/1345
- IPC分类号： G02F1/1345 ; G09F9/00 ; H01L21/60 ; H01L23/498 ; H05K1/02 ; H05K1/14 ; H05K1/18 ; H05K3/36
摘要：
An electric circuit wherein an insulating material having a coefficient of linear expansion approximately equal to that of glass is bonded to a part where an electrode pattern formed on a glass substrate is connected to a conductive pattern formed on a substrate made of an insulating material such as polyimide or the like, thereby restricting the thermal stress to be small at the connecting part between the conductive pattern and electrode pattern.
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