发明授权
US5213949A Method for selectively curing a liquid photosensitive resin by masking
exposure
失效
通过掩蔽曝光选择性地固化液体光敏树脂的方法
- 专利标题: Method for selectively curing a liquid photosensitive resin by masking exposure
- 专利标题(中): 通过掩蔽曝光选择性地固化液体光敏树脂的方法
-
申请号: US764959申请日: 1991-09-25
-
公开(公告)号: US5213949A公开(公告)日: 1993-05-25
- 发明人: Tsutomu Kojima , Takashi Yamashita
- 申请人: Tsutomu Kojima , Takashi Yamashita
- 申请人地址: JPX Osaka
- 专利权人: Asahi Kasei Kogyo Kabushiki Kaisha
- 当前专利权人: Asahi Kasei Kogyo Kabushiki Kaisha
- 当前专利权人地址: JPX Osaka
- 优先权: JPX61-267715 19861112
- 主分类号: G03F1/00
- IPC分类号: G03F1/00 ; G03F7/115 ; G03F7/20
摘要:
An improved method for selectively curing a liquid photosensitive resin by masking exposure is provided, wherein rough, uneven or irregular contact is provided directly or indirectly between the masking film and the substrate. Due to this feature, no interfacial cohesion occurs between the lower surface of the masking film facing the substrate and the upper surface of the substrate facing the masking film. Thus, there are no air pockets formed between the two surfaces. Therefore, there is no danger that the substrate will be caused to protrude into the resin layer so that the ultimate printing plate would have an undesirable local decrease in thickness. As a result, by the method of the present invention, a printing plate having a high degree of uniformity in thickness, can be obtained with reproducibility.
公开/授权文献
信息查询