This apparatus provides a means for automatically controlled removal of integrated circuit assemblies from a testing board or other surface where they have been undergoing quality control tests during the IC manufacturing process. The preferred procedure involves passing an inverted standard test board containing a plurality of standard IC assemblies attached thereto, in parallel rows, over a matching array of spring loaded, wedge shaped extraction fingers, which slide into parallel matching slots between the test board sockets and the attached IC assemblies to disengage and separate the IC assemblies from the test board. The loosened assemblies then drop into parallel, matching, down sloping storage reservoirs for transfer to carrier tubes. Misaligned or jammed assemblies displace the spring loaded extraction fingers axially, causing the particular fingers to activate an extraction finger position sensor which then stops the standard mechanical means that moves the test board over the extraction fingers. The displaced fingers are located by visual or other means, the defective assemblies are removed, the fingers return to their original positions and the test board assembly removal process continues to completion.