发明授权
US5217665A Phenol formaldehyde steam pressing of waferboard 失效
苯酚甲醛蒸汽压片机

Phenol formaldehyde steam pressing of waferboard
摘要:
The present invention relates to a method of producing a waferboard by applying first a liquid phenol formaldehyde resin to the surface of the wafers then a powdered phenol formaldehyde resin followed by forming a layup and pressing at elevated temperature and pressure using steam pressing techniques to consolidate the layup into a board and set the phenol formaldehyde adhesive.
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