A wire-bonding method of an IC uses a capillary having a hole for guiding a bonding wire, the capillary moving vertically and horizontally with respect to the IC so as to bridge a loop between a first bonding and a subsequent second bonding of the wire on predetermined places. The method comprises the steps of heating a wire end extruding from a first opening of the hole to form a ball of the wire; performing the first bonding by a nail head bonding method; pulling the wire coming from the second opening. The tension imposed on the wire hardens a portion of the wire having been softened during the heating process, but is adequately low not break the wire; and moving the capillary so as to perform the second bonding. In a wire-bonding apparatus including a spool and a capillary having a hole to guide the wire therethrough, where the capillary does a first bonding by a nail head bonding method and is movable vertically and horizontally so as to bridge a loop between the first bonding and a subsequent second bonding, there is provided a tension bar, located behind the capillary and rectangular to the wire, to hook the wire at a portion between the capillary and the spool located apart from the center line of the hole. The tension bar is movable from the capillary so as to pull the wire via the hole from the first bonding thus completed. Thus imposed tension hardens the portion of the wire soften by the heat process.