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US5233225A Resin encapsulated pin grid array and method of manufacturing the same 失效
树脂封装针阵列及其制造方法

Resin encapsulated pin grid array and method of manufacturing the same
摘要:
A resin encapsulated pin grid array includes an IC chip mounted on a resin substrate having a plurality of contact pins on its lower surface and resin-encapsulated by injection molding. A metal heat radiating member is integrally formed on the upper surface of the encapsulating resin when the encapsulating resin is injection-molded.
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