公开(公告)号：US5108955A

公开(公告)日：1992-04-28

申请号：US652191

申请日：1991-02-06

申请人： Yoshihiro Ishida ,  Katsuji Komatsu ,  Seiichi Mimura ,  Kikuo Takenouchi ,  Isao Yabe ,  Shingo Ichikawa ,  Yoshihiro Shimada

发明人： Yoshihiro Ishida ,  Katsuji Komatsu ,  Seiichi Mimura ,  Kikuo Takenouchi ,  Isao Yabe ,  Shingo Ichikawa ,  Yoshihiro Shimada

IPC分类号： H01L21/56 ,  H01L23/433

CPC分类号： H01L21/565 ,  H01L23/4334 ,  H01L2224/48227 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/181 ,  H01L2924/1815 ,  Y10S264/76 ,  Y10T29/49121

摘要： A method of making a resin encapsulated pin grid array which includes an IC chip mounted on a resin substrate having a plurality of contact pins on its lower surface and resin-encapsulated by injection molding. A metal heat radiating member is integrally formed on the upper surface of the encapsulating resin when the encapsulating resin is injection-molded.

摘要翻译： 一种制造树脂封装针阵列的方法，其包括安装在其下表面上具有多个接触针的树脂基板上的IC芯片，并通过注射成型树脂封装。 当封装树脂被注射成型时，金属散热构件一体地形成在封装树脂的上表面上。

公开(公告)号：US06362436B1

公开(公告)日：2002-03-26

申请号：US09498482

申请日：2000-02-04

申请人： Hidenori Kimbara ,  Nobuyuki Ikeguchi ,  Katsuji Komatsu

发明人： Hidenori Kimbara ,  Nobuyuki Ikeguchi ,  Katsuji Komatsu

IPC分类号： H05K0116

CPC分类号： H01L24/45 ,  H01L23/13 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49866 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/05647 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/01105 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/40252 ,  H05K1/0373 ,  H05K1/112 ,  H05K3/0038 ,  H05K3/3436 ,  H05K3/4629 ,  H05K2201/0209 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/0979 ,  Y02P70/613 ,  Y10T428/24917 ,  Y10T428/31681 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/0002 ,  H01L2224/45099 ,  H01L2224/43

摘要： Printed wiring board for a chip size scale package, which overcomes the poor adhesion of solder balls to a base material which poor adhesion is caused by a recent decrease in the size of the solder balls, and in the chip size scale package. The distortion of the printed wiring board is decreased and the distortion of a semiconductor plastic package formed by mounting a semiconductor chip on the printed wiring board by wire bonding or flip chip bonding is decreased. The board has at least two blind via holes in one solder-balls-fixing pad.

摘要翻译： 用于芯片尺寸封装的印刷电路板，其克服了焊球对基材的粘附性差，由于焊球的尺寸近来减小以及芯片尺寸尺寸封装，导致粘合性差。 印刷电路板的变形减小，并且通过引线接合或倒装芯片接合将半导体芯片安装在印刷线路板上形成的半导体塑料封装的变形减小。 该板在一个焊球固定垫中至少有两个盲孔。

公开(公告)号：US5233225A

公开(公告)日：1993-08-03

申请号：US752172

申请日：1991-08-23

申请人： Yoshihiro Ishida ,  Katsuji Komatsu ,  Seiichi Mimura ,  Kikuo Takenouchi ,  Isao Yabe ,  Shingo Ichikawa ,  Yoshihiro Shimada

发明人： Yoshihiro Ishida ,  Katsuji Komatsu ,  Seiichi Mimura ,  Kikuo Takenouchi ,  Isao Yabe ,  Shingo Ichikawa ,  Yoshihiro Shimada

IPC分类号： H01L21/56 ,  H01L23/433

CPC分类号： H01L21/565 ,  H01L23/4334 ,  H01L2224/48227 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/1815

摘要： A resin encapsulated pin grid array includes an IC chip mounted on a resin substrate having a plurality of contact pins on its lower surface and resin-encapsulated by injection molding. A metal heat radiating member is integrally formed on the upper surface of the encapsulating resin when the encapsulating resin is injection-molded.

摘要翻译： 树脂封装的针格栅阵列包括安装在树脂基板上的IC芯片，其下表面具有多个接触针，并通过注射成型树脂封装。 当封装树脂被注射成型时，金属散热构件一体地形成在封装树脂的上表面上。

公开(公告)号：US07140103B2

公开(公告)日：2006-11-28

申请号：US10170614

申请日：2002-06-14

申请人： Morio Gaku ,  Nobuyuk Ikeguchi ,  Katsuji Komatsu ,  Yasuo Tanaka ,  Keiichi Iwata ,  Ken-ichi Shimizu

发明人： Morio Gaku ,  Nobuyuk Ikeguchi ,  Katsuji Komatsu ,  Yasuo Tanaka ,  Keiichi Iwata ,  Ken-ichi Shimizu

IPC分类号： H01K3/10

CPC分类号： H05K3/025 ,  H05K3/108 ,  H05K3/427 ,  H05K2201/0347 ,  H05K2203/0723 ,  Y10T29/49155 ,  Y10T29/49165

摘要： Process for producing a high-density printed wiring board, comprising: providing an ultrathin-copper-foil-clad board having a hole and outermost copper foil thickness of 5 μm or less, plating the surface by electroless copper plating to form a layer of 0.1 to 1 μm thickness, forming an electrolytic copper plating layer of 0.5 to 3 μm thickness using the electroless copper plating layer as electrode, forming a plating resist layer on a portion of the copper plating layer, forming a pattern copper plating layer of 6 to 30 μm thickness on the copper surface in where the plating resist layer is not formed, by electrolytic plating, removing the plating resist layer, and etching the entire surface to remove the thin electrolytic copper layer, the electroless copper layer and ultrathin copper foil layer at least where the pattern copper plating layer is not formed.

摘要翻译： 一种制造高密度印刷电路板的方法，包括：提供一种具有孔和最外铜箔厚度为5μm或更小的超薄铜箔包覆板，通过无电镀铜将表面镀覆以形成0.1层 使用无电镀铜层作为电极，形成0.5〜3μm厚的电解镀铜层，在铜镀层的一部分上形成电镀抗蚀剂层，形成6〜30μm的图案镀铜层 通过电解电镀，去除电镀抗蚀剂层，并蚀刻整个表面以除去薄的电解铜层，化学镀铜层和超薄铜箔层至少在铜表面上形成的电镀抗蚀剂层的厚度 其中未形成图案铜镀层。

公开(公告)号：US06479760B2

公开(公告)日：2002-11-12

申请号：US09973688

申请日：2001-10-11

申请人： Hidenori Kimbara ,  Nobuyuki Ikeguchi ,  Katsuji Komatsu

发明人： Hidenori Kimbara ,  Nobuyuki Ikeguchi ,  Katsuji Komatsu

IPC分类号： H05K116

CPC分类号： H01L24/45 ,  H01L23/13 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49866 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/05647 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/01105 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/40252 ,  H05K1/0373 ,  H05K1/112 ,  H05K3/0038 ,  H05K3/3436 ,  H05K3/4629 ,  H05K2201/0209 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/0979 ,  Y02P70/613 ,  Y10T428/24917 ,  Y10T428/31681 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/0002 ,  H01L2224/45099 ,  H01L2224/43

摘要： Provided is a printed wiring board for a chip size scale package, which overcomes the poor adhesion of solder balls to a base material which poor adhesion is caused by a recent decrease in the size of the solder balls, and in the chip size scale package, the distortion of the printed wiring board is decreased and the distortion of a semiconductor package formed by mounting a semiconductor chip on the printed wiring board by wire bonding or flip chip bonding is decreased. The printed wiring board has, as a substrate for a chip scale package, a double-side copper-clad laminate formed of an insulation layer and having copper foils on both surfaces, wherein the double-side copper-clad laminate has an upper copper foil surface and a lower copper foil surface, the upper copper foil surface has a wire bonding or flip chip bonding terminal and has a copper pad in a position where the copper pad can be electrically connected to said wire bonding or flip chip bonding terminal and can be connected to a blind via hole formed in the lower copper surface, the lower copper foil surface has a solder-balls fixing pad in a position corresponding to said copper pad, the solder-balls-fixing pad has at least 2 blind via holes within itself, and the solder-balls-fixing pad connected to a reverse surface of the copper pad with a conductive material is electrically connected with solder balls which are melted and filled in blind via holes so as to be mounded.

摘要翻译： 提供了一种用于芯片尺寸封装的印刷线路板，其克服了焊球对基材的粘附性差，由于焊球的尺寸的最近减小而引起的粘合性差，并且在芯片尺寸尺寸封装中， 印刷电路板的变形减小，并且通过引线接合或倒装芯片接合将半导体芯片安装在印刷线路板上形成的半导体封装的变形减小。 印刷电路板具有作为芯片级封装用基板的双面覆铜层压板，由双面覆铜层压板形成在绝缘层上且两面具有铜箔的双面铜箔叠层体， 表面和较低的铜箔表面，上铜箔表面具有引线键合或倒装芯片接合端子，并且在铜焊盘可以电连接到所述引线接合或倒装芯片接合端子的位置处具有铜焊盘，并且可以 连接到形成在下铜表面的盲孔，下铜箔表面在与所述铜垫相对应的位置具有焊球固定垫，焊球固定垫在其内部具有至少2个盲孔 并且用导电材料连接到铜焊盘的背面的焊球固定焊盘与熔化并填充在盲孔中的焊球电连接以使其隆起。

公开(公告)号：US06396143B1

公开(公告)日：2002-05-28

申请号：US09557974

申请日：2000-04-25

申请人： Hidenori Kimbara ,  Nobuyuki Ikeguchi ,  Katsuji Komatsu

发明人： Hidenori Kimbara ,  Nobuyuki Ikeguchi ,  Katsuji Komatsu

IPC分类号： H01L2334

CPC分类号： H05K1/0204 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K1/056 ,  H05K2201/09054 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012 ,  H01L2224/45099

摘要： A printed wiring board for a ball grid array type semiconductor plastic package which has excellent heat diffusibility and causes no popcorn phenomenon, and a metal-plate-inserted printed wiring board having wire bonding pads formed at two levels, for use in the ball grid array type semiconductor plastic package.

摘要翻译： 一种用于球栅阵列型半导体塑料封装的印刷线路板，具有优异的热扩散性并且不产生爆米花现象，以及具有形成在两个层面上的引线接合焊盘的金属板插入印刷线路板，用于球栅阵列 型半导体塑料封装。

公开(公告)号：US5866948A

公开(公告)日：1999-02-02

申请号：US683156

申请日：1996-07-18

申请人： Gen Murakami ,  Mamoru Mita ,  Toyohiko Kumakura ,  Norio Okabe ,  Katsuji Komatsu ,  Shoji Shinzawa

发明人： Gen Murakami ,  Mamoru Mita ,  Toyohiko Kumakura ,  Norio Okabe ,  Katsuji Komatsu ,  Shoji Shinzawa

IPC分类号： H01L21/60 ,  H01L21/48 ,  H01L21/68 ,  H01L23/12 ,  H01L23/498 ,  H05K3/06 ,  H05K3/40 ,  H01L23/48

CPC分类号： H01L21/6835 ,  H01L21/486 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/05 ,  H05K3/4038 ,  H01L2221/68377 ,  H01L2224/04042 ,  H01L2224/05644 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48644 ,  H01L2224/48799 ,  H01L2224/48844 ,  H01L2224/85444 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/351 ,  H05K2201/10378 ,  H05K2203/0369 ,  H05K2203/0733 ,  H05K2203/1476 ,  H05K3/06

摘要： A substrate 1 of a insulating resin material is provided with a semiconductor chip 2 in the center of the substrate 1 and a lot of fine studs are filled in the substrate 1 around the chip 2. A bonding pad 13 and a land 14 are formed on both end planes of each stud 12 by silver plating. The length of the stud 12 is determined so that the plane of the land 14 and the back side plane of the substrate are approximately co-planar, but it may be longer. The substrate 1 including the studs 12 having the bonding pad 12 and the land 14 is defined as an interposer 15.

摘要翻译： 绝缘树脂材料的基板1在基板1的中央设置有半导体芯片2，并且在芯片2周围的基板1中填充有许多细小的螺柱。焊盘13和焊盘14形成在 每个螺柱12的两个端面通过镀银。 螺柱12的长度被确定为使得焊盘14的平面和衬底的背面平面近似共面，但是可以更长。 包括具有接合焊盘12和焊盘14的螺柱12的基板1被定义为插入件15。

公开(公告)号：US4954308A

公开(公告)日：1990-09-04

申请号：US290227

申请日：1988-12-27

申请人： Isao Yabe ,  Katsuji Komatsu ,  Hiroyuki Kaneko

发明人： Isao Yabe ,  Katsuji Komatsu ,  Hiroyuki Kaneko

IPC分类号： B29C45/14 ,  B29C45/27 ,  G06K19/077 ,  H01L21/56

CPC分类号： G06K19/07724 ,  B29C45/14647 ,  B29C45/2708 ,  G06K19/07745 ,  H01L21/565 ,  B29C2043/5825 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01077 ,  H01L2924/01079

摘要： A resin encapsulating method includes the steps of mounting a plate having a gate groove on a substrate to form a side gate, connected to the side surface of a cavity, between the plate and one of the upper and lower half molds, and filling a resin in the cavity.

摘要翻译： 树脂封装方法包括以下步骤：将具有栅极槽的板安装在基板上，以形成连接到空腔侧表面的板与上下半模中的一个之间的侧栅，并填充树脂 在腔里。

公开(公告)号：US5289039A

公开(公告)日：1994-02-22

申请号：US912065

申请日：1992-07-07

申请人： Yoshihiro Ishida ,  Katsuji Komatsu ,  Seiichi Mimura ,  Kikuo Takenouchi ,  Isao Yabe ,  Shingo Ichikawa ,  Yoshihiro Shimada

发明人： Yoshihiro Ishida ,  Katsuji Komatsu ,  Seiichi Mimura ,  Kikuo Takenouchi ,  Isao Yabe ,  Shingo Ichikawa ,  Yoshihiro Shimada

IPC分类号： H01L21/56 ,  H01L23/433 ,  H01L23/48

CPC分类号： H01L21/565 ,  H01L23/4334 ,  H01L2224/48227 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/15312 ,  H01L2924/181 ,  H01L2924/1815

摘要： A resin encapsulated pin grid array includes an IC chip mounted on a resin substrate having a plurality of contact pins on its lower surface and resin-encapsulated by injection molding. A metal heat radiating member is integrally formed on the upper surface of the encapsulating resin when the encapsulating resin is injection-molded.

摘要翻译： 树脂封装的针格栅阵列包括安装在树脂基板上的IC芯片，其下表面具有多个接触针，并通过注射成型树脂封装。 当封装树脂被注射成型时，金属散热构件一体地形成在封装树脂的上表面上。

公开(公告)号：US5179039A

公开(公告)日：1993-01-12

申请号：US700670

申请日：1991-05-15

申请人： Yoshihiro Ishida ,  Katsuji Komatsu ,  Seiichi Mimura ,  Kikuo Takenouchi ,  Isao Yabe ,  Shingo Ichikawa ,  Yoshihiro Shimada

发明人： Yoshihiro Ishida ,  Katsuji Komatsu ,  Seiichi Mimura ,  Kikuo Takenouchi ,  Isao Yabe ,  Shingo Ichikawa ,  Yoshihiro Shimada

IPC分类号： H01L21/56 ,  H01L23/433

CPC分类号： H01L23/4334 ,  H01L21/565 ,  H01L2224/48227 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/15312 ,  H01L2924/181 ,  H01L2924/1815 ,  Y10T29/49146

摘要： A method of making a resin encapsulated pin grid array includes an IC chip mounted on a resin substrate having a plurality of contact pins on its lower surface and resin-encapsulated by injection molding. A metal heat radiating member is integrally formed on the upper surface of the encapsulating resin when the encapsulating resin is injection-molded.

摘要翻译： 制造树脂封装销栅格阵列的方法包括安装在树脂基板上的IC芯片，该芯片在其下表面上具有多个接触针，并通过注射成型树脂封装。 当封装树脂被注射成型时，金属散热构件一体地形成在封装树脂的上表面上。