Invention Grant
- Patent Title: Electrically conductive circuit member, method of manufacturing the same and electrically conductive paste
- Patent Title (中): 导电电路元件及其制造方法和导电膏
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Application No.: US673072Application Date: 1991-03-21
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Publication No.: US5234558APublication Date: 1993-08-10
- Inventor: Susumu Kadokura
- Applicant: Susumu Kadokura
- Applicant Address: JPX Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JPX Tokyo
- Priority: JPX2-69823 19900322; JPX2-69824 19900322; JPX2-69825 19900322; JPX2-117497 19900509
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H05K1/09 ; H05K3/10 ; H05K3/18 ; H05K3/24
Abstract:
An electrically conductive circuit member, a method for manufacturing the same, and an electrically conductive paste in which the electrically conductive circuit member has an electrically conductive circuit forming a pattern on an insulating substrate. The electrically conductive circuit includes an electrodeposited film containing electrically conductive particles and resin which can be electrically deposited.
Public/Granted literature
- US5702548A Tire having circumferential cables for anchoring the carcass Public/Granted day:1997-12-30
Information query
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