发明授权
- 专利标题： Semiconductor wafer stacking apparatus and method
- 专利标题（中）： 半导体晶片堆垛装置及方法
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申请号： US891536申请日： 1992-06-01
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公开(公告)号： US5240557A公开(公告)日： 1993-08-31
- 发明人: Lawrence D. Dyer , Dempsey McGregor , Robert M. Montgomery , Jerry B. Medders , Michael R. Head , Tom G. Gullett
- 申请人： Lawrence D. Dyer , Dempsey McGregor , Robert M. Montgomery , Jerry B. Medders , Michael R. Head , Tom G. Gullett
- 申请人地址： TX Dallas
- 专利权人： Texas Instruments Incorporated
- 当前专利权人： Texas Instruments Incorporated
- 当前专利权人地址： TX Dallas
- 主分类号： H01L21/304
- IPC分类号： H01L21/304 ; H01L21/306 ; H01L21/673 ; H01L21/677
摘要：
An apparatus stacks semiconductor wafers and spacers and clamps them in an axial alignment for mounting in a semiconductor wafer edge polishing machine. After edge polishing, the apparatus separates the wafers and spacers and delivers them respectively into separate cassettes for further processing or recycling.
公开/授权文献
- US5995404A DRAM architecture with aligned data storage and bond pads 公开/授权日：1999-11-30
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