发明授权
- 专利标题： Wire bonding method and apparatus
- 专利标题（中）： 引线接合方法和装置
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申请号： US751143申请日： 1991-08-28
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公开(公告)号： US5251805A公开(公告)日： 1993-10-12
- 发明人: Mitsukiyo Tani , Akira Gotoh , Hideaki Sasaki , Hideo Shiraishi , Tamotu Kirino , Hiroshi Hasegawa
- 申请人： Mitsukiyo Tani , Akira Gotoh , Hideaki Sasaki , Hideo Shiraishi , Tamotu Kirino , Hiroshi Hasegawa
- 申请人地址： JPX Tokyo JPX Tokyo
- 专利权人： Hitachi, Ltd.,Hitachi Computer Electronics, Co.
- 当前专利权人： Hitachi, Ltd.,Hitachi Computer Electronics, Co.
- 当前专利权人地址： JPX Tokyo JPX Tokyo
- 优先权： JPX2-239549 19900910
- 主分类号： H01L21/603
- IPC分类号： H01L21/603 ; B23K20/10 ; H01L21/00 ; H01L21/60 ; H01R43/02 ; B23K31/02 ; H01L21/607
摘要：
A wire bonding method and apparatus for welding a wire with at least one end formed with a ball and a pad of a printed wiring board. A bonding head moves downward slowly to crush the ball to form a flat surface, and will move upward once to adjust a relative position of the pad and the ball. The bonding head will move downward again, and an ultrasonic wave is applied to heat the ball and the bonding head so that the ball and the pad are welded. If necessary, a portion of the wire to be bent is moved to a desired position of the wiring board, by a supporting apparatus. A free end of the wire which is not welded is moved by a jig to bend the portion of the wire for routing.
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