发明授权
- 专利标题: Substrate member having electric lines and apertured insulating film
- 专利标题(中): 具有电线和多孔绝缘膜的基片部件
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申请号: US859750申请日: 1992-03-30
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公开(公告)号: US5252781A公开(公告)日: 1993-10-12
- 发明人: Masaharu Shirai , Kimihiro Yamanaka
- 申请人: Masaharu Shirai , Kimihiro Yamanaka
- 申请人地址: NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: NY Armonk
- 优先权: JPX3-156123 19910531
- 主分类号: H01L21/48
- IPC分类号: H01L21/48 ; H01L23/538 ; H05K1/11 ; H05K3/34 ; H05K1/00
摘要:
In a substrate member (e.g., circuit board), a plurality of openings (15) are formed in an insulating film (14) which covers electric lines (12) formed on a substrate 11, with pad constructing (contacting) portions (13) of selected ones of the electric lines being exposed. In one example, the pad constructing portion (that portion of the pad to which final connection is to occur, e.g., by solder to a semiconductor device), is set to a first dimension (e.g., length) having a dimension less than a corresponding dimension of the original length. The film openings are also set to another dimension having an allowance size larger than a corresponding dimension of the pad constructing portion. The opening is thus of sufficiently large size in comparison to the respective pad being exposed so as to assure effective tolerance compensation for film positioning deviations in at least two (e.g., X and Y) directions as might occur during production of the substrate member.
公开/授权文献
- US5837160A Chiral CLCPs containing colored monomers 公开/授权日:1998-11-17