A light emitting diode exposure head for a recording apparatus which comprises an aligned assembly of a plurality of diode modules, each module including an array of said diodes and associated circuit boards mounted on a common base, the diode modules being supported in elevated position above the base, and interconnection circuit strips for the modules disposed on the base in partial overlapping relation beneath the margins of the elevated modules, the interconnection strips having a line of bonding pads for making wire-bonded connections with the circuit boards.