发明授权
US5258649A Semiconductor device and electronic apparatus using semiconductor device
失效
半导体器件和使用半导体器件的电子设备
- 专利标题： Semiconductor device and electronic apparatus using semiconductor device
- 专利标题（中）： 半导体器件和使用半导体器件的电子设备
-
申请号： US918137申请日： 1992-07-23
-
公开(公告)号： US5258649A公开(公告)日： 1993-11-02
- 发明人: Akira Tanaka , Kazuji Yamada , Tadahiko Miyoshi , Kanji Otsuka
- 申请人： Akira Tanaka , Kazuji Yamada , Tadahiko Miyoshi , Kanji Otsuka
- 申请人地址： JPX Tokyo
- 专利权人： Hitachi, Ltd.
- 当前专利权人： Hitachi, Ltd.
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX1-127556 19890520
- 主分类号： H01L21/56
- IPC分类号： H01L21/56 ; H01L23/31 ; H01L23/433 ; H01L23/498 ; H05K3/32 ; H01L23/02 ; H01L23/48
摘要：
A silicon chip is mounted on a portion a heat dissipation body, and a carrier film is inserted into a resin composition material. Each of input/output electrode portions of the silicon chip is connected electrically to each of lead wires of the carrier film. The electrical connection between the silicon chip and a circuit substrate is carried out by the carrier film. Another portion of the heat dissipation body is exposed on a surface of the resin composition material. A fixing means for fixing the resin composition material is formed integrally to the resin composition material or to the heat dissipation body. The resin composition material is fixed to a circuit substrate through the fixing means. The mechanical fixing between the resin composition material and the circuit substrate is carried out by the fixing means, which is separate from the carrier film. A heat dissipation fin may be provided on the heat dissipation body.
公开/授权文献
- US5992165A Apparatus for supplying cold air in refrigerators 公开/授权日：1999-11-30