发明授权
- 专利标题： Bonder tool cleaning mechanism
- 专利标题（中）： 粘合剂工具清洗机构
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申请号： US879573申请日： 1992-05-07
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公开(公告)号： US5259155A公开(公告)日： 1993-11-09
- 发明人: Hisao Ishida , Akihiro Nishimura , Koji Sato
- 申请人： Hisao Ishida , Akihiro Nishimura , Koji Sato
- 申请人地址： JPX Tokyo
- 专利权人： Kabushiki Kaisha Shinkawa
- 当前专利权人： Kabushiki Kaisha Shinkawa
- 当前专利权人地址： JPX Tokyo
- 主分类号： B08B1/04
- IPC分类号： B08B1/04 ; B24B7/16
摘要：
In a bonder tool cleaning mechanism in a bonding machine, a coarse grindstone, a finishing grindstone and a wire brush are provided on a cleaning section, and when a bonding tool is moved above the cleaning section and then moved down to come into contact with the grindstones and brush, the cleaning section oscillates horizontally so that grindstones and brush clean the bonding tool.
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