发明授权
- 专利标题： Wire bonding method
- 专利标题（中）： 接线方式
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申请号： US901418申请日： 1992-06-19
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公开(公告)号： US5259548A公开(公告)日： 1993-11-09
- 发明人: Nobuto Yamazaki , Kazuo Sugiura , Minoru Torihata , Kuniyuki Takahashi , Tatsunari Mii
- 申请人： Nobuto Yamazaki , Kazuo Sugiura , Minoru Torihata , Kuniyuki Takahashi , Tatsunari Mii
- 申请人地址： JPX Tokyo
- 专利权人： Kabushiki Kaisha Shinkawa
- 当前专利权人： Kabushiki Kaisha Shinkawa
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX3-173397 19910619
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H01L21/607 ; H01L20/60
摘要：
In order to avoid an excessive wire loop curvature at a second bonding point, a wire bonding is performed with the steps of: moving the capillary, after the wire is connected to a first bonding point, toward the second bonding point, and right before the capillary comes above the second bonding point, the capillary is moved down obliquely so that the capillary is positioned exactly above the second bonding point, and then the capillary is moved down straight so that the wire is pressed against the second bonding point.
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