公开(公告)号：US20110079904A1

公开(公告)日：2011-04-07

申请号：US12925388

申请日：2010-10-20

申请人： Tatsunari Mii ,  Shinsuke Tei ,  Hayato Kiuchi

发明人： Tatsunari Mii ,  Shinsuke Tei ,  Hayato Kiuchi

IPC分类号： H01L23/48

CPC分类号： H01L24/85 ,  B23K20/007 ,  B23K2101/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/78301 ,  H01L2224/85181 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  Y10T29/49124 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/85399 ,  H01L2224/05599

摘要： Wire bonding method for reducing height of a wire loop in a semiconductor device, including a first bonding step of bonding an initial ball formed at a tip end of a wire onto a first bonding point using a capillary, thereby forming a pressure-bonded ball; a wire pushing step of pushing the wire obliquely downward toward the second bonding point at a plurality of positions by repeating a sequential movement for a plurality of times, the sequential movement including moving of the capillary substantially vertically upward and then obliquely downward toward the second bonding point by a distance shorter than a rising distance that the capillary has moved upward; and a second bonding step of moving the capillary upward and then toward the second bonding point, and bonding the wire onto the second bonding point by pressure-bonding.

摘要翻译： 用于降低半导体器件中的导线环的高度的引线接合方法，包括使用毛细管将形成在线顶端的初始球接合到第一接合点上的第一接合步骤，从而形成压接球; 丝线按压步骤，通过重复多次顺序移动，在多个位置上将丝线向下倾斜向下朝向第二接合点，该顺序移动包括毛细管基本上垂直向上移动然后向下倾斜朝向第二接合 指向比毛细管向上移动的上升距离短的距离; 以及第二接合步骤，用于将毛细管向上移动并朝向第二接合点，并且通过压接将电线接合到第二接合点上。

公开(公告)号：US07910472B2

公开(公告)日：2011-03-22

申请号：US12802295

申请日：2010-06-03

申请人： Tatsunari Mii ,  Toshihiko Toyama ,  Hiroaki Yoshino

发明人： Tatsunari Mii ,  Toshihiko Toyama ,  Hiroaki Yoshino

IPC分类号： H01L21/44

CPC分类号： B23K20/004 ,  B23K2101/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/05554 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48475 ,  H01L2224/48479 ,  H01L2224/4848 ,  H01L2224/48487 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48655 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48855 ,  H01L2224/49171 ,  H01L2224/78301 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2224/85205 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85455 ,  H01L2224/85986 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2224/48227 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/01049 ,  H01L2224/4554

摘要： A semiconductor device with improved bondability between a wire and a bump and cutting property of the wire to improve the bonding quality. In the semiconductor device, a wire is stacked on a pad as a second bonding point to form a bump having a sloped wedge and a first bent wire convex portion, and a wire is looped from a lead as a first bonding point to the bump and is pressed to the sloped wedge of the bump with a face portion of a tip end of a capillary to bond the wire to the bump. At the same time, the wire is pressed to the first bent wire convex portion using an inner chamfer of a bonding wire hole in the capillary to form a wire bent portion having a bow-shaped cross section. The wire is pulled up and cut at the wire bent portion.

摘要翻译： 一种半导体器件，其具有改善焊丝和凸块之间的接合性以及焊丝的切割性能，以提高焊接质量。 在半导体装置中，作为第二接合点将焊盘叠置在焊盘上，以形成具有倾斜楔形件和第一弯曲导线凸起部分的凸块，并且将引线作为第一接合点从引线环绕到凸点， 被压到具有毛细管的顶端的表面部分的凸起的倾斜楔块上，以将线接合到凸起。 同时，使用毛细管中的接合线孔的内倒角将线压向第一弯曲线凸部，以形成具有弓形横截面的线弯曲部。 线被拉起并在线弯曲部分处切割。

公开(公告)号：US07821140B2

公开(公告)日：2010-10-26

申请号：US12727812

申请日：2010-03-19

申请人： Tatsunari Mii ,  Hayato Kiuchi

发明人： Tatsunari Mii ,  Hayato Kiuchi

IPC分类号： H01L23/48 ,  H01L21/44

CPC分类号： H01L24/85 ,  H01L23/49517 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L25/50 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4846 ,  H01L2224/48465 ,  H01L2224/4847 ,  H01L2224/48475 ,  H01L2224/48599 ,  H01L2224/4911 ,  H01L2224/49426 ,  H01L2224/49429 ,  H01L2224/78301 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85201 ,  H01L2224/859 ,  H01L2224/85951 ,  H01L2224/85986 ,  H01L2225/06506 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/30105 ,  H01L2924/00 ,  H01L2224/4554 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A semiconductor device has a first layer pressing portion that is formed by crushing a ball neck formed by bonding an initial ball onto a first layer pad of a first layer semiconductor die and pressing the side of a wire folded onto the crushed ball neck, a first wire extended in the direction of a lead from the first layer pressing portion, and a second wire that is looped from a second layer pad of a second layer semiconductor die toward the first layer pressing portion and joined onto the second layer pad side of the first layer pressing portion. Thereby, the connection of wires is performed at a small number of times of bonding, while reducing damages caused on the semiconductor dies.

摘要翻译： 半导体器件具有第一层压制部分，其通过将通过将初始焊球接合到第一层半导体管芯的第一层焊盘而将压合折叠到破碎的球颈上的焊丝的一侧按压而形成的球颈形成， 线从第一层按压部分沿引线的方向延伸，以及第二线，其从第二层半导体管芯的第二层焊盘环绕到第一层挤压部分并且接合到第一层压垫部分的第二层焊盘侧上 层压部。 由此，在少量的接合时进行导线的连接，同时减少对半导体管芯造成的损伤。

公开(公告)号：US20090001608A1

公开(公告)日：2009-01-01

申请号：US12215317

申请日：2008-06-26

申请人： Tatsunari Mii ,  Hayato Kiuchi

发明人： Tatsunari Mii ,  Hayato Kiuchi

IPC分类号： H01L23/49 ,  B23K31/00

CPC分类号： H01L24/85 ,  B23K20/005 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L2224/05554 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/48475 ,  H01L2224/49175 ,  H01L2224/78301 ,  H01L2224/78744 ,  H01L2224/85045 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/859 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/4554

摘要： After bonding a wire to a pad on a surface of a semiconductor chip, a capillary is moved toward a lead and toward a direction opposite to the lead as the wire is fed out, and a first kink that is convex in a direction opposite to the lead, a second kink that is convex toward the lead, and a straight portion that continues from the second kink are formed in the wire. Then, the capillary is moved to form a loop and bonds the wire to the lead. During this bonding, the straight portion is formed into a linear portion in a direction along the surface of the lead, and the linear portion is pressed to the surface of the lead.

摘要翻译： 在将导线接合到半导体芯片的表面上的焊盘之后，当引线被送出时，毛细管朝着引线移动并且朝向与引线相反的方向移动，并且沿与第一引线相反的方向凸起的第一扭结 引线，朝向引线凸出的第二扭结，以及从第二扭结延续的直线部分形成在导线中。 然后，毛细管被移动以形成环并将导线连接到引线。 在该接合期间，直线部分沿着铅的表面的方向形成直线部分，并且直线部分被压到引线的表面。

公开(公告)号：US06595400B2

公开(公告)日：2003-07-22

申请号：US09934890

申请日：2001-08-22

申请人： Yoshimitsu Terakado ,  Tooru Mochida ,  Tatsunari Mii ,  Shigeru Shiozawa

发明人： Yoshimitsu Terakado ,  Tooru Mochida ,  Tatsunari Mii ,  Shigeru Shiozawa

IPC分类号： B23K3700

CPC分类号： H01L24/85 ,  B23K20/005 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/78301 ,  H01L2224/786 ,  H01L2224/851 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01051 ,  H01L2924/01082 ,  H01L2924/00 ,  H01L2224/45099

摘要： In a wire bonding apparatus in which a wire is passed through a capillary that is provided at one end of a bonding arm and a clamper that holds the wire is disposed directly above the capillary, the distance between the upper surface of the capillary and the undersurface of the clamper is set as a very short distance as 1.5 mm or less.

摘要翻译： 在导线通过设置在接合臂的一端的毛细管的线接合装置中，并且保持线的夹持器直接设置在毛细管的上方，毛细管的上表面与下表面之间的距离 的夹持器设置为1.5mm或更小的非常短的距离。

公开(公告)号：US6080651A

公开(公告)日：2000-06-27

申请号：US42842

申请日：1998-03-17

申请人： Kuniyuki Takahashi ,  Tooru Mochida ,  Tatsunari Mii ,  Nobuto Yamazaki

发明人： Kuniyuki Takahashi ,  Tooru Mochida ,  Tatsunari Mii ,  Nobuto Yamazaki

IPC分类号： H01L21/60 ,  H01L21/447

CPC分类号： H01L24/85 ,  H01L24/49 ,  H01L24/78 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/78301 ,  H01L2224/85181 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  Y10S228/904 ,  Y10S438/907

摘要： A wire bonding method in the manufacture of, for instance, a semiconductor device in which first bonding points or pads of a chip and second bonding points or leads of a lead frame are connected by wires, and the bonding by wires is initiated from one end of the row of the first bonding points (pads) and is successively performed in one direction toward a center of the row, and after bonding has been performed up to an approximate center of the row, then bonding is initiated from another end of the row in the opposite direction toward the center of the row.

摘要翻译： 在制造例如半导体器件中的引线接合方法，其中第一接合点或芯片的焊盘和引线框架的第二接合点或引线通过电线连接，并且通过电线的接合从一端开始 的第一接合点（焊盘）的列，并且在朝向行的中心的一个方向上连续执行，并且在接合之后已经被执行到行的大致中心，然后从行的另一端开始接合 在朝向行的中心的相反方向。

公开(公告)号：US5884830A

公开(公告)日：1999-03-23

申请号：US915821

申请日：1997-08-21

申请人： Nobuto Yamazaki ,  Minoru Torihata ,  Tatsunari Mii

发明人： Nobuto Yamazaki ,  Minoru Torihata ,  Tatsunari Mii

IPC分类号： H01L21/60 ,  B23K20/00 ,  B23K20/10

CPC分类号： H01L24/85 ,  B23K20/007 ,  H01L24/78 ,  H01L2224/45015 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/78303 ,  H01L2224/85045 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/14 ,  H01L2924/20751 ,  H01L2924/20752

摘要： In a capillary used in a wire bonding apparatus that has a wire threading hole through which a bonding wire of 10 to 30 .mu.m diameter passes and is provided with two chamfers, i.e., lower and upper chamfers, near the tip end of the wire threading hole, the upper chamfer has a chamfer angle of 3 to 19 degrees and a depth of 20 to 50 microns.

摘要翻译： 在用于具有丝穿线孔的引线接合装置中的毛细管中，直径为10至30μm的接合线通过该穿线孔，并且在电线穿线的尖端附近设置有两个倒角，即下倒角和上倒角 上倒角具有3至19度的倒角角度和20至50微米的深度。

公开(公告)号：US5259548A

公开(公告)日：1993-11-09

申请号：US901418

申请日：1992-06-19

申请人： Nobuto Yamazaki ,  Kazuo Sugiura ,  Minoru Torihata ,  Kuniyuki Takahashi ,  Tatsunari Mii

发明人： Nobuto Yamazaki ,  Kazuo Sugiura ,  Minoru Torihata ,  Kuniyuki Takahashi ,  Tatsunari Mii

IPC分类号： H01L21/60 ,  H01L21/607 ,  H01L20/60

CPC分类号： H01L24/85 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/78301 ,  H01L2224/82181 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L24/78 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14

摘要： In order to avoid an excessive wire loop curvature at a second bonding point, a wire bonding is performed with the steps of: moving the capillary, after the wire is connected to a first bonding point, toward the second bonding point, and right before the capillary comes above the second bonding point, the capillary is moved down obliquely so that the capillary is positioned exactly above the second bonding point, and then the capillary is moved down straight so that the wire is pressed against the second bonding point.

摘要翻译： 为了避免第二接合点处的线环弯曲过度，以下步骤进行引线接合：在将导线连接到第一接合点之后，将毛细管移动到第二接合点， 毛细管位于第二结合点之上，毛细管倾斜地向下移动，使得毛细管位于第二结合点的正上方，然后毛细管被直线向下移动，使得金属丝压靠第二结合点。

公开(公告)号：US08678266B2

公开(公告)日：2014-03-25

申请号：US11361640

申请日：2006-02-24

申请人： Tatsunari Mii ,  Toshihiko Toyama

发明人： Tatsunari Mii ,  Toshihiko Toyama

IPC分类号： B23K31/02

CPC分类号： B23K20/005 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/78301 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/15787 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2224/4554

摘要： A wire bonding method for bonding a ball 11 which is formed at a tip end of a bonding wire to a pad 2 that is a first bond point to form a first bonding part 12 and bonding the wire 10 to an interconnect wiring 4 that is a second bond point to form a second bonding part, thus connecting the pad 2 and the interconnect wiring with the wire, wherein after the ball is bonded to the first bond point and a capillary 6 is ascended, examination is performed to find any bonding failure of the first bonding part; and when the bonding failure at the first bond point is found, then the capillary is caused to descend to execute bonding to bond the first bonding part to the first bond point.

摘要翻译： 一种用于将形成在接合线的末端的球11接合到作为第一接合点的焊盘2以形成第一接合部12并将导线10接合到作为第一接合点的布线4的引线接合方法 第二接合点形成第二接合部分，从而将焊盘2和互连布线与线连接，其中，在球接合到第一接合点并且毛细管6上升之后，进行检查以发现任何接合故障 第一结合部分; 并且当发现在第一结合点处的接合失效时，使毛细管下降以执行结合以将第一粘结部分结合到第一粘结点。

公开(公告)号：US20120139129A1

公开(公告)日：2012-06-07

申请号：US13396699

申请日：2012-02-15

申请人： Tatsunari Mii ,  Shinsuke Tei ,  Hayato Kiuchi

发明人： Tatsunari Mii ,  Shinsuke Tei ,  Hayato Kiuchi

IPC分类号： H01L23/52

CPC分类号： H01L24/85 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4846 ,  H01L2224/48465 ,  H01L2224/78301 ,  H01L2224/85148 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85951 ,  H01L2924/00014 ,  H01L2924/01002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： After forming a pressure-bonded ball and a ball neck by bonding an initial ball to a pad, a capillary is moved upward, away from a lead, and then downward, thereby the ball neck is trodden on by a face portion that is on the lead side of the capillary. Subsequently, the capillary is moved upward and then toward the lead until the face portion of the capillary is positioned above the ball neck, thereby a wire is folded back toward the lead. Then, the capillary is moved downward such that a side of the wire is pressed by the capillary against the ball neck that has been trodden on. After the capillary is moved obliquely upward toward the lead and then looped toward the lead, the wire is pressure-bonded to the lead.

摘要翻译： 在通过将初始球粘合到垫上而形成压接球和球颈之后，毛细管向上移动远离铅，然后向下移动，从而使球颈由位于 毛细管的一侧。 随后，毛细管向上移动，然后朝向引线，直到毛细管的面部位于球颈上方，从而将导线折回到引线。 然后，毛细管向下移动，使得丝的一侧被毛细管压靠在已经踩踏的球颈上。 毛细管朝向引线倾斜向上移动，然后环绕导线时，导线被压接在引线上。