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US5262032A Sputtering apparatus with rotating target and target cooling 失效
具有旋转目标和目标冷却的溅射装置

Sputtering apparatus with rotating target and target cooling
摘要:
A sputtering apparatus is presented, especially one with a magnetron cathode and rotating target (1), and target cooling performed by a liquid coolant, preferably water, in which provision is made for the cooling to be concentrated on the area or areas of the rotating target (1) which are exposed to the heat produced by the plasma (12), and the magnets (28, 29, 30, 31) of the magnet assembly (23) form at least one cooling passage (34, 35).
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