发明授权
- 专利标题: Package structure of multi-chip light emitting diode
- 专利标题(中): 多芯片发光二极管的封装结构
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申请号: US884195申请日: 1992-05-18
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公开(公告)号: US5266817A公开(公告)日: 1993-11-30
- 发明人: Paul Y. S. Lin
- 申请人: Paul Y. S. Lin
- 专利权人: Lin Paul Y S
- 当前专利权人: Lin Paul Y S
- 主分类号: H01L25/075
- IPC分类号: H01L25/075 ; H01L33/60 ; H01L33/00
摘要:
A light emitting diode includes a base with a recess and a housing mounted above the base. A conductive plate is mounted in the recess with a red chip, a green chip, and two blue chips disposed thereon, all of which being enclosed by the housing. A first pin has a first contact electrically connected to the red chip and a second contact extending downward and out of the base. A second pin has a first contact electrically connected to the green chip and a second contact extending downward and out of the base. A third pin has a first contact electrically connected to the blue chips and a second contact extending downward and out of the base. A common cathode pin has a first contact electrically connected to the conductive plate and a second contact extending downward and out of the base. Different intensities of light of the three primary colors emitted by the chips result in any desired colored light. A bottom surface and a peripheral wall of the recess are covered by a scattering agent, providing a complete mixing of light emitted by the chips.
公开/授权文献
- US6131925A Beach buddy 公开/授权日:2000-10-17