An interlevel connector, a multilayer wiring board assembly, and method for making the same are presented. The interlevel connector includes a dielectric substrate having a plurality of through holes and a corresponding plurality of pultrusions. Each pultrusion includes a plurality of electrically conductive fibers and an electrically conductive or insulating host material carrying the plurality of fibers, each of the plurality of pultrusions being located in a respective through hole and having fibrillated portions extending from surfaces of the dielectric substrate. The interlevel connector is used in the construction of a multilayer wiring assembly in which first and second wiring boards having respective conductive portions are interconnected. The interlevel connector is located adjacent and between the first and second wiring boards, whereby the fibrillated portions of the pultrusion extending from the surfaces of the dielectric substrate contact the conductive portions of the first and second wiring boards. The wiring boards can be permanently or removably locatable adjacent the dielectric substrate.