发明授权
- 专利标题: Particle flux shadowing for three-dimensional topography simulation
- 专利标题(中): 用于三维地形模拟的粒子通量阴影
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申请号: US904001申请日: 1992-06-24
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公开(公告)号: US5282140A公开(公告)日: 1994-01-25
- 发明人: Satoshi Tazawa , Tetsuya Abe , Francisco A. Leon
- 申请人: Satoshi Tazawa , Tetsuya Abe , Francisco A. Leon
- 申请人地址: CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: CA Santa Clara
- 主分类号: G06F17/50
- IPC分类号: G06F17/50 ; G06F15/46 ; G06F15/72
摘要:
In a three-dimensional (3-D) topography simulator, a method for removing sources of particle flux because of neighboring topology, for a point on a workpiece undergoing a deposition or etch process step. The method is practiced in a Generalized Solids Modeling system that utilizes a boundary representation model for representing a workpiece as one or more material object solids. For any given point on the 3-D structure, the neighboring topography forms a complex shadowing mask with respect to sources of particle flux, thus making analytical determination of visible sources of incoming particle flux difficult. The method is comprised generally of the steps of: defining a numerical mesh in a space over a surface of the workpiece; specifying an intensity of incident flux for each mesh point, identifying a set of mesh points defining a visible range of mesh points with respect to a particular target point and identifying mesh points in said set of mesh points that are obscured by neighboring topology.
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