发明授权
- 专利标题： Planar multi-layer metal bonding pad
- 专利标题（中）： 平面多层金属焊盘
-
申请号： US889807申请日： 1992-05-29
-
公开(公告)号： US5287002A公开(公告)日： 1994-02-15
- 发明人: John L. Freeman, Jr. , Clarence J. Tracy
- 申请人： John L. Freeman, Jr. , Clarence J. Tracy
- 申请人地址： IL Schaumburg
- 专利权人： Motorola, Inc.
- 当前专利权人： Motorola, Inc.
- 当前专利权人地址： IL Schaumburg
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H01L23/485 ; H01L23/48 ; H01L29/40 ; H01L29/46 ; H01L29/52
摘要：
A planarized multi-layer metal bonding pad. A first metal bonding pad layer (13) that defines a metal bonding pad is provided. A first dielectric layer (14) is provided with a multitude of vias (17) that covers the first metal bonding pad layer (13), thereby exposing portions of the first metal bonding pad layer (13) through the multitude of vias (17) in the first dielectric (14). A second metal bonding pad layer (18) that further defines the metal bonding pad is deposited on the first dielectric layer (14) making electrical contact to the first metal bonding pad layer through the multitude of vias (17). Planarization of the second metal bonding pad layer (18) is achieved by having the second metal bonding pad layer (18) cover the first dielectric layer (14) and making contact through the vias (17).
公开/授权文献
信息查询
IPC分类:
