An apparatus for inserting and extracting an integrated circuit package (IC) of the type having pins from terminals of a socket installed on a circuit board. The apparatus includes a package support member positioned between the package and socket, a cover attached over the package, and a socket support member between the socket and the circuit board to support the socket. The package support member has thru-holes to permit the package pins to extend through the member and engage terminals installed in the socket. The apparatus further includes an insertion/extraction member coupled to the package support member. The insertion/extraction member can be placed in a position between the package support member and the socket support member such that movement of the insertion/extraction member causes the pins to engage corresponding terminals of the socket and when placed in a position between the socket support member and the circuit board, movement of the insertion/extraction member causes pins to withdraw from the terminals.